Microwave Curing Molding Chamber for Semiconductor Warpage Reduction

Solution Overview

Problem

The existing compression molding processes for semiconductor wafers often induce stresses and warpage due to non-uniform curing of the molding compound, leading to device failure and reduced efficiency.

Innovation Solution

A molding chamber that uses microwave radiation to cure the molding compound, allowing for uniform heating and reducing thermal expansion differences between materials, thereby minimizing stress and warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional curing processes are used to harden the molding compound, then the compound becomes impervious to the exterior environment, but stresses are induced within the device structure leading to warpage or failure

Engineering Contradiction:

Improveimperviousness to exterior environmentVSAvoiddevice warpage

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces conventional thermal curing (mechanical heating system) with microwave curing (electromagnetic field system). The microwave generator emits electromagnetic radiation that directly heats the molding compound through dielectric heating, eliminating the thermal gradients and mechanical stress associated with conventional oven-based curing processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the curing parameter from thermal conduction-based heating to electromagnetic radiation-based heating. By using microwave frequency electromagnetic fields, the curing process achieves uniform energy distribution throughout the molding compound, transforming the heating mechanism to eliminate stress-induced warpage while maintaining complete encapsulation.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If conventional curing processes are used to harden the molding compound, then the compound becomes impervious to the exterior environment, but the efficiency and yield of the molding process are adversely affected

Engineering Contradiction:

Improveimperviousness to exterior environmentVSAvoidmolding process efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces conventional thermal curing (mechanical heating system) with microwave curing (electromagnetic field system). The microwave generator emits electromagnetic radiation that directly heats the molding compound through dielectric heating, eliminating the thermal gradients and mechanical stress associated with conventional oven-based curing processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the curing parameter from thermal conduction-based heating to electromagnetic radiation-based heating. By using microwave frequency electromagnetic fields, the curing process achieves uniform energy distribution throughout the molding compound, transforming the heating mechanism to eliminate stress-induced warpage while maintaining complete encapsulation.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The microwave curing process achieves lower processing temperatures and reduced warpage, enhancing the yield and throughput of the molding process while minimizing stress on semiconductor devices.

Implementation Method 1

A molding chamber that uses microwave radiation to cure the molding compound

Methodology Applied

Scientific EffectMicrowave radiation: Microwave Radiation

Implementation Method 2

The resin is dispensed on the device generally without a particular shape. Components of the chamber are then brought together to compress the molding around the device thereby encapsulating the device with the compound.

Methodology Applied

Scientific EffectDielectric heating: Dielectric Heating

Implementation Method 3

Components of the chamber are then brought together to compress the molding around the device thereby encapsulating the device with the compound

Methodology Applied

Scientific EffectCompression: Compression

Implementation Method 4

During typical curing processes, stresses can be induced within the device structure, which may lead to device warpage or failure

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9950450B2Molding chamber apparatus and curing method

Publication Date: 2018.04.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An embodiment is a molding chamber. The molding chamber comprises a mold-conforming chase, a substrate-base chase, a first radiation permissive component, and a microwave generator coupled to a first waveguide. The mold-conforming chase is over the substrate-base chase, and the mold-conforming chase is moveable in relation to the substrate-base chase. The first radiation permissive component is in one of the mold-conforming chase or the substrate-base chase. The microwave generator and the first waveguide are together operable to direct microwave radiation through the first radiation permissive component.