Microwave Feeding Structure for TE11-to-TE10 Mode Conversion
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Solution Overview
Problem
Existing semiconductor microwave ovens require a microwave feeding structure that can convert the TE11 mode output by semiconductor power sources into the TE10 mode adaptive for microwave heating, as the frequency bands used in communication and heating applications differ, necessitating a flexible and efficient conversion method.
Innovation Solution
A microwave feeding structure comprising a semiconductor power source, a microwave feeding assembly, and a rectangular wave guide that includes components such as a mounting tube, ceramic ring, tube case, and antenna to convert the TE11 mode into a TE10 mode, allowing efficient microwave heating while being simple in structure and wide in application range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetron tube is used to generate microwave, then the microwave can be fed into the chamber body effectively, but the structure becomes complex and costly
Solution Approach 1:
The patent extracts the magnetron tube from the microwave generation system and replaces it with a semiconductor power source. This removes the complex high-voltage components (transformer, capacitor, diode) associated with magnetrons, simplifying the overall structure while maintaining microwave generation capability through the semiconductor-based TE11 mode source
Solution Approach 2:
The patent changes the microwave generation parameters from magnetron-based high-voltage pulsing to semiconductor-based controlled frequency generation. The semiconductor power source operates at TE11 mode and converts to TE10 mode, providing different frequency characteristics and control parameters compared to traditional magnetrons, enabling simplified structure with maintained effectiveness
2Device complexity
If semiconductor power source is used to generate microwave, then the structure becomes simple and cost-effective, but the microwave mode (TE11) is not adaptive for heating
Solution Approach 1:
The patent applies parameter changes by converting the microwave mode from TE11 (output by semiconductor power source) to TE10 (adaptive for heating). This mode conversion adjusts the electromagnetic field distribution parameters to match the requirements of efficient heating applications while maintaining the simplicity of the semiconductor-based structure
Solution Approach 2:
The patent introduces a mode conversion mechanism as an intermediary between the semiconductor power source and the chamber body. This intermediary component transforms the TE11 mode microwave into TE10 mode, enabling the semiconductor source to effectively drive heating applications without compromising structural simplicity
3Power
If traditional magnetron system is used, then high power can be generated, but the weight and volume increase significantly
Solution Approach 1:
The patent extracts and removes the heavy components of the traditional magnetron system (magnetron tube, large transformer, high-voltage capacitor). The semiconductor power source generates equivalent or superior power with significantly reduced weight, as it eliminates the need for heavy magnetic and high-voltage electrical components
Solution Approach 2:
The patent replaces the mechanical/electromagnetic magnetron system with a semiconductor electronic system. The semiconductor power source uses electronic field effects rather than mechanical magnetic fields, resulting in dramatically reduced weight and volume while maintaining or enhancing power generation capability
4Power
If traditional magnetron system is used, then high power can be generated, but the overall device volume increases
Solution Approach 1:
The patent extracts the bulky components of the magnetron system (large transformer, high-voltage capacitor, magnetron tube housing) and replaces them with compact semiconductor power source. This extraction and replacement dramatically reduces the overall device volume while preserving high power generation capability
Solution Approach 2:
The patent substitutes the bulky mechanical magnetron system with a compact semiconductor electronic system. The semiconductor-based architecture inherently occupies less space as it eliminates large magnetic cores, high-voltage insulation structures, and complex electromagnetic shielding required by traditional magnetrons
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-efficiency, low-cost, and lightweight semiconductor microwave ovens with a large power density per unit volume, capable of flexible operation and broad application, by effectively converting the microwave mode for efficient heating.
Implementation Method 1
a microwave feeding assembly connected between the semiconductor power source and the chamber body, and configured to feed the microwave generated by the semiconductor power source into the chamber body and to convert a first microwave mode output by the semiconductor power source into a second microwave mode adaptive to microwave heating
Implementation Method 2
a microwave feeding assembly connected between the semiconductor power source and the chamber body, and configured to feed the microwave generated by the semiconductor power source into the chamber body
Data Source
AI summary
A semiconductor microwave oven and a microwave feeding structure thereof are provided. The microwave feeding mechanism of the semiconductor microwave oven includes: a chamber body (26) having a door (25); a semiconductor power source (42) configured to generate a microwave; and a microwave feeding assembly connected between the semiconductor power source (42) and the chamber body (26), and configured to feed the microwave generated by the semiconductor power source (42) into the chamber body (26) and to convert a first microwave mode output by the semiconductor power source (42) into a second microwave mode adaptive to microwave heating.