Microwave Feeding Module Circuit Board Structure

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Solution Overview

Problem

Conventional satellite signal processing systems face challenges in minimizing insertion loss while integrating a low dielectric loss printed circuit board with satellite antennas and back-stage signal processing circuits, as low dielectric loss boards are expensive and not well-suited for integration.

Innovation Solution

A circuit board structure with a dielectric substrate, grounding sheets, top and bottom feeding sheets, and a conductive layer, where the substrate has a rib segment and extending segments with specific hole configurations, and a microwave feeding module incorporating a septum polarizer, waveguide, and cover, to reduce insertion loss by electrical coupling and isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a printed circuit board with low dielectric loss is used to minimize insertion loss, then insertion loss is reduced, but the cost increases and integration with satellite antenna and signal processing circuit becomes difficult

Engineering Contradiction:
Improveinsertion lossVSAvoidintegration ease
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The circuit board is divided into multiple segments with different dielectric loss characteristics. The first circuit board segment has low dielectric loss for signal transmission, while the second circuit board segment has higher dielectric loss for integration with satellite antenna and signal processing circuit. This segmentation allows each segment to be optimized for its specific function, resolving the contradiction between minimizing insertion loss and enabling easy integration.

Inventive Principle:
Principle #1Segmentation

2Loss of energy

If a printed circuit board with low dielectric loss is used, then insertion loss is minimized, but the cost increases

Engineering Contradiction:
Improveinsertion lossVSAvoidmanufacturing cost
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

Different regions of the circuit board structure have different dielectric loss properties tailored to their specific functions. The first circuit board segment uses low dielectric loss material where signal transmission is critical, while the second circuit board segment uses higher dielectric loss material where integration is needed. This local quality differentiation allows cost optimization by using expensive low-loss materials only where absolutely necessary.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces insertion loss while allowing for integration with satellite antennas and back-stage signal processing circuits, utilizing a more affordable substrate with higher dielectric loss, thereby improving system performance and cost-effectiveness.

Implementation Method 1

The conductive layer is disposed in a plurality of first holes, disposed in the main segment and the rib segment, for electrically coupling the grounding sheets, and the conductive layer is further disposed in a plurality of second holes disposed in the extending segments, and configured for electrically coupling the top feeding sheets to the bottom feeding sheets

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP3772771B1Microwave feeding module and circuit board structure
Publication Date: 2021.10.06 MICROELECTRONICS TECH INC
  • EP3772771B1 patent drawingFigure 1
  • EP3772771B1 patent drawingFigure 2
  • EP3772771B1 patent drawingFigure 3

AI summary

The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.