Microwave Absorbing Layer Control for Low-Warpage Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor packaging processes face challenges due to high power consumption and thermal expansion coefficient differences, leading to warpage and inefficient heat conversion in microwave-curable materials, particularly in lightweight, thin, and miniaturized packaging, where the universal application of microwave processing is hindered by specific shape and frequency limitations.
Innovation Solution
A microwave heating device comprising a microwave generator, a microwave absorbing layer with highly heat-resistant polymers and particles like graphene, a thermal interface layer, and a temperature measuring system with a controller to optimize microwave absorption and heat distribution, allowing for controlled heating of semiconductor packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microwave processing is applied to lightweight, thin, and miniaturized semiconductor packaging, then heating efficiency is improved, but the absolute volume of material capable of absorbing microwaves is reduced, causing heat conversion rate to rapidly lower
Solution Approach 1:
The patent applies composite materials by combining microwave-absorbing particles (such as carbon black, graphite, or metal oxides) with the polymer matrix material. This composite structure enables the material to effectively absorb microwave energy even in thin and miniaturized packaging, maintaining high heat conversion rates despite reduced absolute volume. The microwave-absorbing particles are dispersed throughout the polymer to create a material that converts microwave energy into heat efficiently.
Solution Approach 2:
The patent implements local quality by strategically distributing microwave-absorbing particles within the polymer matrix at specific concentrations and locations. This ensures that the regions most critical for heating receive sufficient microwave absorption capability, optimizing heat generation in the specific areas needed for the packaging process while accommodating the reduced volume constraints of miniaturized devices.
2Manufacturing precision
If typical microwave processing devices are used, then processing for specific shapes and samples is achieved, but universal application to existing semiconductor packaging is difficult
Solution Approach 1:
The patent achieves universality by designing a microwave-absorbing polymer material with adjustable properties that can accommodate various packaging shapes, sizes, and configurations. The material composition and microwave-absorbing particle concentration can be tailored to suit different semiconductor packaging requirements, enabling a single material system to serve multiple applications across different device form factors and packaging styles.
Solution Approach 2:
The patent applies dynamics by making the microwave-absorbing polymer material adaptable and adjustable rather than fixed. The material properties, including particle distribution, concentration, and type, can be dynamically optimized for different packaging scenarios, allowing the same base material system to be configured for various shapes and sizes of semiconductor devices, thereby achieving universal applicability.
3Strength
If high temperature long-term process is used to harden material, then material hardening is achieved, but process defects due to warpage of semiconductor are increasing
Solution Approach 1:
The patent replaces the conventional thermal hardening process with microwave-induced heating. Instead of applying external heat over a long period that causes thermal gradients and warpage, the microwave energy is absorbed directly by the polymer material itself, generating heat uniformly throughout the material volume. This substitution of the heating mechanism eliminates the thermal gradients that cause warpage while still achieving the required material hardening.
Solution Approach 2:
The patent utilizes periodic microwave action to harden the material. The microwave energy is applied in controlled pulses or cycles, allowing the material to heat uniformly and cure without excessive thermal stress. This periodic heating approach prevents the continuous thermal stress that leads to warpage, while still achieving complete hardening of the packaging material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively heats semiconductor packaging, improving heat conversion rates and reducing energy consumption, while enabling universal application across various semiconductor packaging shapes and sizes by controlling microwave power based on temperature measurements.
Implementation Method 1
a microwave absorbing layer configured to receive the microwaves so as to be heated
Implementation Method 2
a polymer material directly absorbs microwaves to perform curing by rotation and frictional heat of molecules
Implementation Method 3
a thermal interface layer between the microwave absorbing layer and the temperature measuring layer
Implementation Method 4
a sensor provided on and inside the temperature measuring layer to detect a temperature of the temperature measuring layer
Implementation Method 5
a thermal interface layer between the microwave absorbing layer and the temperature measuring layer
Data Source
AI summary
Provided are a microwave heating device and a method for manufacturing a semiconductor packaging using the same. The microwave heating device includes a microwave generator configured to generate microwaves, a microwave absorbing layer configured to receive the microwaves so as to be heated, a temperature measuring layer provided on the microwave absorbing layer, a sensor configured to detect a temperature of the temperature measuring layer, and a controller connected to the sensor and the microwave generator to determine the temperature of the microwave absorbing layer using a detection signal of the sensor, the controller being configured to control a voltage of the microwaves provided from the microwave generator based on the temperature of the microwave absorbing layer.