Perpendicular Microwave Module Layout for Compact Antenna Arrays

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Solution Overview

Problem

Conventional microwave modules face challenges in reducing size in the direction of the antenna surface due to parallel mounting with the antenna elements, leading to increased power loss, noise, and difficulty in scalable design changes.

Innovation Solution

The microwave module is designed with a substrate perpendicular to the antenna surface, allowing for reduced size and efficient heat dissipation through a perpendicular mounting configuration, eliminating the need for wire offsets and enabling scalable design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the microwave module is mounted with the substrate parallel to the antenna surface, then the mounting structure is simple, but the size of the microwave module in the direction of the antenna surface becomes large

Engineering Contradiction:
Improvemounting structure complexityVSAvoidsize of microwave module in antenna surface direction
Core Design Contradiction:
Device complexityVSLength of stationary object

Solution Approach 1:

The substrate is mounted perpendicular to the antenna surface instead of parallel, changing the mounting dimension from in-plane to out-of-plane. This dimensional change allows the microwave module to extend in the thickness direction of the antenna rather than the surface plane, thereby reducing the footprint on the antenna surface while maintaining all necessary mounting functions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the microwave modules are offset with respect to the antenna elements to accommodate frequency changes, then the antenna can operate in higher frequency bands, but the wires between microwave modules and antenna elements become long causing power loss and noise

Engineering Contradiction:
Improvefrequency band adaptabilityVSAvoidpower loss in wires
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

Instead of offsetting the microwave modules from the antenna elements (conventional approach), the invention inverts the relationship by mounting the substrate perpendicular to the antenna surface with the microwave devices directly facing the antenna elements. This inverted configuration shortens the connection paths, reducing wire length and thereby minimizing power loss and noise while maintaining frequency adaptability

Inventive Principle:
Principle #13The other way round (Inversion)

3Adaptability or versatility

If the array size of antenna elements is changed, then the antenna can be scaled, but the offset amount of microwave modules must change requiring large-scale design changes

Engineering Contradiction:
Improvearray size scalabilityVSAvoiddesign change complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The perpendicular mounting configuration creates a universal interface where the substrate can accommodate different array sizes without requiring design changes. The standardized perpendicular mounting structure serves multiple functions: it maintains consistent connection geometry, simplifies thermal management, and allows the same substrate design to be used across different antenna configurations, thereby enabling scalability without design complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of operation

If the microwave module size in the antenna surface direction is reduced, then mountability improves, but the semiconductor chip planar size cannot be reduced unless output power changes

Engineering Contradiction:
Improvemountability of microwave moduleVSAvoidplanar size of semiconductor chip
Core Design Contradiction:
Ease of operationVSArea of moving object

Solution Approach 1:

The invention relocates the semiconductor chip from a parallel mounting orientation to a perpendicular mounting orientation relative to the antenna surface. This dimensional change allows the chip to extend in the thickness direction rather than the surface plane, effectively reducing the planar footprint on the antenna surface while maintaining the same chip area and output power capabilities

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12401111B2Antenna
Publication Date: 2025.08.26 MITSUBISHI ELECTRIC CORP
  • US12401111B2 patent drawing
  • US12401111B2 patent drawing
  • US12401111B2 patent drawing

AI summary

A microwave module includes a plurality of microwave devices and a microwave module substrate. Each of the plurality of microwave devices exchanges a signal with a corresponding one of a plurality of antenna elements. The microwave module substrate includes a mounting surface on which the plurality of microwave devices are mounted. The microwave module substrate is electrically connected to each of the plurality of antenna elements. The mounting surface is perpendicular to a plane surface on which the plurality of antenna elements are arrayed.