Perpendicular Microwave Module Layout for Phased Array Antennas
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Solution Overview
Problem
Conventional phased array antennas face challenges in reducing the size of microwave modules in the direction of the antenna surface due to parallel mounting, leading to increased power loss, noise, and difficulty in conforming to scalable designs as the frequency increases.
Innovation Solution
The microwave module is mounted on a substrate perpendicular to the antenna surface, allowing for a reduction in size and efficient heat dissipation through a perpendicular configuration, which includes a cooling plate and heat dissipation sheets, and eliminates the need for offset positioning of modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the microwave module is mounted with the mounting surface parallel to the antenna surface, then the microwave device can be mounted on the substrate, but the size of the microwave module in the direction of the antenna surface cannot be reduced below the planar size of the semiconductor chip
Solution Approach 1:
The patent applies dimensionality change by rotating the mounting surface from a parallel orientation to a perpendicular orientation relative to the antenna surface. This reorients the microwave module in a different spatial dimension, allowing the module's footprint in the antenna surface direction to be reduced to approximately one-quarter of the semiconductor chip's planar size, while maintaining all necessary electrical connections through the vertically oriented substrate.
2Speed
If the frequency of the microwave is increased, then the antenna can operate at higher frequencies (Ku band or higher), but the interval at which antenna elements are arrayed must be reduced, making it difficult to array microwave modules at the required interval
Solution Approach 1:
The perpendicular mounting configuration reduces the microwave module's dimension in the antenna surface direction to approximately one-quarter of the semiconductor chip's planar size. This dimensional reduction enables the arraying of microwave modules at intervals suitable for high-frequency operations in the Ku band and higher, where element spacing must be minimized.
Solution Approach 2:
The patent changes the mounting orientation parameter from parallel to perpendicular, which fundamentally alters the spatial footprint of the microwave module. This parameter change enables compatibility with the reduced element spacing requirements of high-frequency antenna systems without requiring changes to the microwave device itself.
3Volume of moving object
If the microwave module is reduced in size in the direction of the antenna surface, then mountability improves, but the semiconductor chip's planar size cannot be reduced unless output power changes
Solution Approach 1:
The patent achieves size reduction in the antenna surface direction without altering the semiconductor chip's planar dimensions or output power by reorienting the mounting surface perpendicular to the antenna surface. This spatial reconfiguration allows the module to present a smaller profile in the critical antenna surface direction while maintaining the chip's full functional capability.
4Speed
If wires are used to connect antenna elements and microwave modules with offset positioning, then the antenna can function at higher frequencies, but power loss increases and noise in received signals increases due to long wires
Solution Approach 1:
The perpendicular mounting configuration eliminates the need for offset positioning and long connecting wires by enabling direct integration of the microwave module with the antenna element. The vertically oriented substrate allows signal paths to be substantially perpendicular to the antenna surface, dramatically reducing wire length and associated power losses while maintaining high-frequency operation.
Data Source
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AI summary
A microwave module (2) includes a plurality of microwave devices and a microwave module substrate (3). Each of the plurality of microwave devices exchanges a signal with a corresponding one of a plurality of antenna elements (4). The microwave module substrate (3) includes a mounting surface on which the plurality of microwave devices are mounted. The microwave module substrate (3) is electrically connected to each of the plurality of antenna elements (4). The mounting surface is perpendicular to a plane surface on which the plurality of antenna elements (4) are arrayed.