Microwave Module Integrated Shielding Resolves Coupling and Cost
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Solution Overview
Problem
Conventional microwave modules require additional components like electromagnetic shields or radio wave absorbers to suppress electromagnetic wave coupling, leading to increased costs.
Innovation Solution
A microwave module design featuring a multilayer resin substrate with integrated electromagnetic shielding and heat dissipation, where RF devices are surface-mounted on the substrate, eliminating the need for external shields and reducing size, weight, and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal cover with electromagnetic shield or radio wave absorber is installed to suppress electromagnetic wave coupling, then spatial isolation is improved, but cost increases
Solution Approach 1:
The patent merges the electromagnetic shielding function with the substrate structure by integrating ground through-holes and surface grounds directly into the multilayer resin substrate. This combines the substrate's mechanical support function with the electromagnetic shielding function, eliminating the need for separate metal covers and shields, thereby reducing cost while maintaining spatial isolation.
Solution Approach 2:
The patent extracts the electromagnetic shielding function from the metal cover structure and relocates it to the substrate level through ground through-holes and surface grounds. This extraction allows the shielding function to be implemented at the source of electromagnetic radiation, effectively reducing coupling without requiring additional metal cover components.
2Object-affected harmful factors
If a metal cover surrounding RF devices is installed, then spatial isolation is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions (substrate support, electromagnetic shielding, heat dissipation, and signal grounding) into a single integrated multilayer resin substrate structure. By combining these functions, the overall device complexity is reduced while maintaining effective spatial isolation between RF devices.
Solution Approach 2:
The multilayer resin substrate serves multiple functions simultaneously: it provides mechanical support for mounting RF devices, acts as an electromagnetic shield through integrated ground structures, dissipates heat through thermal pathways, and provides signal routing. This multi-functionality eliminates the need for separate components, reducing device complexity.
3Object-affected harmful factors
If additional electromagnetic shielding components are installed, then spatial isolation is improved, but weight increases
Solution Approach 1:
The patent extracts the electromagnetic shielding function from heavy metal cover components and relocates it to the lightweight substrate structure through ground through-holes and surface grounds. This extraction maintains shielding effectiveness while dramatically reducing the weight of the overall module.
Solution Approach 2:
The patent changes the material parameter from heavy metal (for covers and shields) to lightweight resin substrate with integrated ground structures. This parameter change maintains electromagnetic shielding functionality while reducing the weight of stationary objects in the module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses electromagnetic wave radiation without external shields, achieving cost reduction, size minimization, and weight reduction while maintaining effective heat dissipation.
Implementation Method 1
each of the microwave devices including a microwave circuit and an electromagnetic shield wall at least covering the microwave circuit
Implementation Method 2
a heat dissipator thermally connected to the microwave circuit
Implementation Method 3
is signal-connected to a distribution circuit board by a spring contact terminal
Data Source
AI summary
A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.