Microwave Module Packaging Transition Board Design
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Solution Overview
Problem
Existing RF assemblies for microwave and millimeter wave devices suffer from high RF losses, voltage reflections, and electrical mismatching, which limit their frequency performance capabilities and increase costs due to the need for expensive cables and connectors to maintain signal integrity.
Innovation Solution
A packaging solution that includes a baseplate with a microwave or millimeter wave component, a substantially planar transition board with connectors on both sides, and a cover forming a cavity, which eliminates the need for expensive feed-throughs by using inexpensive connectors and providing a protected electromagnetic interference environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If expensive cables and connectors are used to preserve signal characteristics, then signal integrity is maintained, but device cost increases
Solution Approach 1:
The patent extracts and eliminates the expensive feed-through components from the assembly. Instead of using traditional feed-throughs for DC and RF connections, the invention uses a circuit board with surface-mounted connectors and capacitors, removing the need for costly coaxial cable assemblies and specialized connectors while maintaining signal integrity through proper PCB design and grounding.
2Reliability
If traditional feed-through assemblies are used for DC and RF connections, then electrical connections are established, but RF losses and voltage reflections increase
Solution Approach 1:
The patent replaces the mechanical feed-through connection system with an electrical circuit board system. Instead of using physical feed-throughs that create discontinuities and parasitics, the invention uses a circuit board with printed circuit traces, surface-mounted capacitors, and connectors that provide low-inductance DC paths and maintain RF signal integrity, eliminating voltage reflections and reducing RF losses.
3Reliability
If hermetic military microwave hardware assemblies are used, then device protection is provided, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the assembly into modular components: a circuit board with mounted connectors and capacitors, a housing with mounting brackets, and separate DC and RF connection points. This modular approach simplifies manufacturing and assembly compared to traditional hermetic military assemblies, allowing for easier fabrication, testing, and replacement of individual components while maintaining adequate protection for the electronic devices.
Data Source
AI summary
Microwave or millimeter wave system packaging having a system with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.