Microwave Module Shielding Cover Diplexer Integration
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Solution Overview
Problem
Existing microwave link components face challenges in achieving cost-effective and weatherproof designs due to mechanical tolerances and thermal issues caused by the mismatch of stacked components, leading to increased internal temperatures.
Innovation Solution
The integration of a diplexer and isolators into the shielding cover and printed circuit board (PCB) with a compact design, using the PCB and housing parts as shielding, and incorporating cooling flanges, O-rings for sealing, and tunable filter geometry to eliminate tolerance chains and enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a diplexer is purchased as a pre-tuned part with a fixed sub-band, then the manufacturing cost is reduced, but the adaptability to different sub-bands is lost
Solution Approach 1:
The diplexer is designed with tunable filters that can be adjusted to different sub-bands using tuning screws and adjustable resonant cavities, transforming a static pre-tuned component into a dynamically adjustable one, thereby achieving both cost-effectiveness and adaptability
2Ease of manufacture
If PCB, shielding cover, diplexer and waveguide nose are stacked assembly, then the manufacturing ease is improved, but the mechanical tolerance mismatch increases
Solution Approach 1:
The diplexer and filter are integrated directly into the shielding cover as an integral part, eliminating the separate diplexer component and reducing the number of assembly interfaces, thereby minimizing cumulative mechanical tolerance mismatches while maintaining manufacturing ease
Solution Approach 2:
The shielding cover serves multiple functions: it provides electromagnetic shielding, houses the integrated diplexer and filter, and acts as a structural component, thereby reducing the total number of parts and assembly steps while improving precision
3Reliability
If PCB is positioned between housing parts with shielding cover and waveguide nose, then the signal transfer is improved, but the thermal distance to heat sink increases
Solution Approach 1:
Cooling flanges are positioned on the exterior surface of the housing in a radial direction, creating a new thermal pathway perpendicular to the signal path, thereby improving heat dissipation without interfering with microwave signal transfer between PCB and waveguide
4Device complexity
If multiple separate components are assembled, then the device complexity is reduced, but the weatherproofing reliability decreases
Solution Approach 1:
Multiple components (diplexer, filter, housing) are merged into fewer integrated structures, reducing the number of assembly interfaces and sealing points, thereby improving weatherproofing reliability while maintaining simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution results in a compact, cost-effective, and weatherproof microwave module with improved thermal performance and reduced assembly complexity, ensuring efficient signal transfer and protection from environmental factors.
Implementation Method 1
The diplexer is a component that extracts a desired sub-band from a microwave signal
Implementation Method 2
The plated area is adapted to function as a metal cover towards the filter geometry of the second housing part
Implementation Method 3
the PCB has a plated wave guide hole adapted to feed the signal in and out from the antenna
Data Source
Figure 1
Figure 2~4
Figure 5~6
AI summary
The present invention relates to a microwave module (1) comprising a printed circuit board (2), a first housing part (31), a second housing part (32), and a diplexer. It is specifically proposed that the first and second housing part (31, 32) are adapted to act as a shielding cover, and that the diplexer and its filter is an integrated part in the module and is made out of the shielding cover and the printed circuit board (2).