Microwave Package Cavity Resonance Control

The cavity is divided into multiple segments by providing partition walls (first partition wall and second partition wall) that extend from the bottom surface toward the top surface. This segmentation creates multiple smaller cavity spaces, each with its own resonant frequency, thereby preventing the overall cavity resonant frequency from overlapping with the operation frequency band while maintaining the required package dimensions for high power output.

Dielectric members are selectively positioned at specific locations within the cavity (between the amplifier chip and the top surface, and between the dividing circuit board and the top surface) to locally adjust the electromagnetic field distribution. This local modification of dielectric properties allows precise control over the cavity resonant frequency without requiring overall package dimension changes.

Instead of using a complete dielectric cap that would uniformly increase permittivity throughout the cavity, dielectric members are selectively positioned only at specific locations where electromagnetic field concentration occurs. This localized approach provides the necessary frequency adjustment while minimizing the overall impact on cavity resonant frequency and maintaining the cost benefits of dielectric materials.

The permittivity parameters of dielectric members are carefully selected and adjusted to achieve the desired resonant frequency shift. By controlling the permittivity values and positions of these dielectric members, the cavity resonant frequency can be precisely tuned without requiring complete dielectric cap construction.

Instead of using complete partition walls that would divide the entire cavity space and restrict mounting flexibility, the invention uses partition walls that extend only partially from the bottom surface toward the top surface. This partial segmentation approach adjusts the resonant frequency while leaving sufficient open space for various semiconductor element mounting methods and circuit substrate configurations.

The partition walls are designed to extend in a controlled manner from the bottom surface toward the top surface without fully connecting, creating a three-dimensional segmented structure. This dimensional approach allows frequency control through spatial segmentation while maintaining mounting flexibility by not completely dividing the cavity space.

The partition wall structure and dielectric member configuration can be adjusted through simple parameter changes (dimensions, positions, permittivity values) to accommodate different operation frequency bands. This universal design approach allows the same basic package structure to be adapted for various frequency requirements without requiring complete redesign, thereby reducing development time and cost.

By providing adjustable parameters such as partition wall dimensions, dielectric member positions and permittivity values, the cavity resonant frequency can be tuned to avoid overlap with different operation frequency bands. This parameter-based adjustment mechanism enables rapid adaptation to different frequency requirements without extensive redesign.