Microwave Plasma Applicator Layout for Constricted Gas Coupling
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Solution Overview
Problem
In semiconductor manufacturing, remote plasma sources with traditional applicator configurations suffer from sub-optimal power transfer, leading to inefficient plasma generation, especially when microwave power is coupled to gas through a single surface, resulting in reduced plasma formation efficiency.
Innovation Solution
The remote plasma source architecture is enhanced by positioning the microwave applicator to constrict the gas flow path, allowing the gas to pass through small gaps between the applicator and the housing, thereby exposing it to a higher electromagnetic field for improved plasma generation, and incorporating a dielectric liner to reduce electron escape and enhance plasma efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microwave power is coupled to gas through a single surface in traditional applicator configurations, then the device complexity is reduced, but plasma generation efficiency deteriorates
Solution Approach 1:
The patent transitions from single-surface microwave coupling to multi-surface coupling by positioning the applicator to constrain gas flow through small gaps, exposing gas to electromagnetic fields from multiple surfaces simultaneously. This dimensional change in power coupling geometry dramatically improves plasma generation efficiency
Solution Approach 2:
The applicator is segmented into multiple surfaces that independently couple microwave power to the gas. Each surface segment contributes to plasma generation in the constricted flow regions, allowing distributed power transfer that enhances overall efficiency
2Object-affected harmful factors
If the plasma is moved away from the substrate surface using a remote plasma source, then substrate damage is reduced, but plasma generation efficiency deteriorates due to sub-optimal power transfer
Solution Approach 1:
The patent implements multi-surface microwave coupling in the remote plasma source, where the applicator constrains gas flow through small gaps and exposes it to electromagnetic fields from multiple surfaces. This resolves the efficiency problem inherent in remote configurations while maintaining the substrate protection benefit
3Adaptability or versatility
If conventional plasma generation methods are used, then device simplicity is maintained, but the ability to generate plasma at low pressures deteriorates
Solution Approach 1:
The patent changes the electromagnetic field coupling parameters by implementing multi-surface exposure through constricted flow paths. This parameter change enables efficient plasma generation across a broader pressure range, including low pressures where conventional single-surface methods fail
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves plasma generation efficiency, enabling the creation of high-efficiency plasmas, such as pure hydrogen plasma at low pressures, which are not compatible with conventional methods, and reduces substrate damage by maintaining the plasma away from the processing chamber surface.
Implementation Method 1
the applicator comprises a dielectric body, and a pin inserted in a hole in the dielectric body
Implementation Method 2
exposing it to a higher electromagnetic field for improved plasma generation
Implementation Method 3
the applicator comprises a dielectric body
Implementation Method 4
positioning the microwave applicator to constrict the gas flow path, allowing the gas to pass through small gaps between the applicator and the housing
Implementation Method 5
The plasma is struck in the antechamber and excited gas molecules flow out an exhaust that couples the antechamber to the main processing chamber
Data Source
AI summary
Embodiments disclosed herein include a remote plasma source. In an embodiment, the remote plasma source comprises a housing where a fluidic channel passes from a first end to a second end of the housing. In an embodiment, an applicator intersects the fluidic channel. In an embodiment, the applicator comprises a dielectric body, and a pin inserted in a hole in the dielectric body.