Bottom-Launch Microwave Reflector Substrate Heating Uniformity
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Solution Overview
Problem
Conventional process chambers face challenges in achieving uniform heating of substrates due to the 'edge hot' phenomenon, where peripheral edges heat up quicker than the rest of the substrate when exposed to microwave energy, and existing techniques for addressing this issue are unpredictable and uncontrollable.
Innovation Solution
A process chamber configured for bottom launch delivery of microwave energy, utilizing a first and second microwave reflector positioned above and beneath the substrate support, respectively, to evenly distribute microwave energy across the substrate, with an optional third reflector for additional uniform heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If microwave energy is provided through sidewall (side launch) of the process chamber, then the substrates can be heated, but uniform heating of the substrates is hard to achieve due to edge hot phenomenon
Solution Approach 1:
The patent inverts the conventional side-launch microwave configuration by implementing a bottom-launch configuration where microwave energy is delivered from beneath the substrate support. This inversion fundamentally changes the heating pattern, allowing microwave energy to pass through the substrate support and heat the substrate from the bottom, thereby eliminating the edge hot phenomenon that occurs with side-launch configurations.
Solution Approach 2:
The substrate support acts as an intermediary element that enables bottom-launch microwave heating. The microwave energy passes through the substrate support (which serves as a mediator) to reach the substrate, allowing controlled energy distribution across the substrate surface and achieving uniform heating that would not be possible with direct side-launch configuration.
2Manufacturing precision
If conventional techniques (rotating hoop, microwave stirrer, frequency sweeping) are used to overcome non-uniform heating, then heating uniformity may improve, but the techniques are unpredictable and uncontrollable
Solution Approach 1:
The patent replaces unpredictable mechanical systems (rotating hoops, microwave stirrers) with a static bottom-launch microwave configuration. Instead of mechanically agitating the substrate or microwaves, the system uses a fixed geometric arrangement where microwave energy is delivered from beneath the substrate support, providing predictable and controllable heating that eliminates the need for complex mechanical motion systems.
3Manufacturing precision
If bottom launch delivery of microwave energy is used, then uniform heating can be achieved, but additional hardware (microwave reflectors) is required to distribute energy evenly
Solution Approach 1:
The patent applies local quality by positioning microwave reflectors at specific locations (first reflector above the substrate support, second reflector beneath the substrate support) to locally control and redirect microwave energy. This localized placement allows precise control over energy distribution patterns, achieving uniform heating through targeted reflection rather than requiring complex system-wide modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures more even and predictable heating of substrates, reducing or eliminating the 'edge hot' phenomenon by reflecting microwave energy from the bottom surface of the reflectors back to the substrate, providing consistent temperature distribution across the substrate.
Implementation Method 1
a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber
Implementation Method 2
some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation
Data Source
AI summary
Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.