Microwave Sheath Thickness Measurement in Plasma Processing Substrates
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Solution Overview
Problem
Current plasma processing apparatuses lack an efficient method to measure the thickness of the plasma sheath without requiring a dedicated measuring device, which is necessary for precise plasma processing in electronic device manufacturing.
Innovation Solution
A measuring device integrated with a substrate, including a transmission circuit, transmitting and receiving antennas, a reception demodulation circuit, and a calculator, which generates and transmits microwaves to measure the sheath thickness by analyzing reflected waves, allowing for real-time thickness calculation without a dedicated measuring device within the plasma processing apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a dedicated measuring device is used to measure sheath thickness, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent combines the sheath thickness measurement function with the substrate by integrating a microwave transmission unit and reception unit directly into the substrate structure. This merging eliminates the need for a separate dedicated measuring device, thereby reducing device complexity while maintaining measurement precision through the integrated microwave reflection analysis method
Solution Approach 2:
The substrate is given multiple functions: it serves both as the object to be processed in plasma and as a measuring device for sheath thickness measurement. The integrated microwave transmission and reception capabilities enable the substrate to perform self-measurement, achieving multi-functionality that reduces overall system complexity
2Measurement precision
If a dedicated measuring device is integrated into the plasma processing apparatus, then measurement capability is improved, but ease of operation deteriorates
Solution Approach 1:
The substrate performs self-measurement of the sheath thickness by incorporating the microwave transmission and reception units directly into its structure. This self-service capability eliminates the need for external measuring devices and complex operational procedures, thereby improving ease of operation while maintaining measurement precision
3Productivity
If microwave transmission and reception units are integrated into the substrate, then productivity is improved, but device complexity increases
Solution Approach 1:
The microwave transmission unit and reception unit are merged into the substrate structure, enabling simultaneous plasma processing and sheath thickness measurement. This integration allows for real-time monitoring and adjustment, improving plasma processing efficiency and productivity while the compact integration minimizes the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient measurement of the plasma sheath thickness, facilitating improved plasma processing by integrating the measurement functionality directly into the substrate, enhancing processing precision and versatility across various plasma processing apparatuses.
Implementation Method 1
a transmitting antenna 5, configured to transmit a microwave as a transmission wave
Implementation Method 2
a reception antenna 6 configured to receive a reflected wave of the transmission wave by the plasma PL as a reception wave
Data Source
AI summary
A measuring device includes a substrate disposed on a substrate support of a plasma processing apparatus, a transmission circuit, a transmitting antenna, a receiving antenna, a reception demodulation circuit, and a calculator which are provided in the substrate. The transmission circuit generates a microwave. The transmitting antenna transmits the microwave generated by the transmission circuit as a transmission wave. The receiving antenna receives a reflected wave of the transmission wave by plasma above the substrate support as at least one reception wave. The reception demodulation circuit generates a signal that reflects a thickness of a sheath between the substrate and the plasma, from the reception wave. The calculator obtains the thickness of the sheath from the signal generated by the reception demodulation circuit.