Microwave-Shielding Enclosure With Heat Pipe for Aerosol PCB Cooling
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Solution Overview
Problem
Aerosol-generating devices using microwaves face challenges in effectively shielding microwaves and dissipating heat generated by the source circuit, particularly due to the high heat output from printed circuit boards.
Innovation Solution
The device incorporates a heat pipe with a heat sink and thermal interface material to manage heat dissipation while shielding microwaves, utilizing a heat pipe with a bending portion and protruding region, and a heat sink with multiple heat dissipation plates, integrated with a metal enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a source circuit generates microwaves for heating aerosol-generating articles, then aerosol generation is enabled, but a large amount of heat is generated that requires effective dissipation
Solution Approach 1:
The patent combines the microwave shielding function and heat dissipation function into a single integrated structure. The enclosure portion made of metal material simultaneously shields microwaves generated by the source circuit and conducts heat away from the source circuit through its thermally conductive properties, eliminating the need for separate shielding and heat dissipation components.
Solution Approach 2:
The metal enclosure portion serves multiple functions: it acts as a microwave shield to contain RF signals, provides a thermal conduction path for heat dissipation from the source circuit, and structurally supports the heat pipe and heat sink components. This multi-functionality reduces device complexity while solving both microwave containment and thermal management problems.
2Object-affected harmful factors
If shielding materials are added to block microwaves, then microwave leakage is prevented, but device space is limited and heat dissipation becomes more difficult
Solution Approach 1:
The patent merges the microwave shielding enclosure with the heat dissipation structure into a single integrated component. The metal enclosure portion that shields microwaves also serves as the heat conduction path, and the heat pipe is integrated within the same structural space, maximizing space utilization while achieving both shielding and heat dissipation functions.
3Temperature
If heat dissipation components are added to manage thermal output, then heat is dissipated effectively, but device complexity increases
Solution Approach 1:
The patent integrates the heat pipe and heat sink directly with the metal enclosure portion, forming a unified heat dissipation system. The first region of the heat pipe is disposed in the recess of the enclosure portion and connected to the source circuit, while the heat sink extends outward, creating an integrated thermal management solution that reduces the number of separate components and assembly steps.
4Object-affected harmful factors
If the source circuit is enclosed to shield microwaves, then RF signal leakage is prevented, but heat generated by the source circuit accumulates
Solution Approach 1:
The patent combines microwave shielding and heat dissipation functions into the same metal enclosure structure. The enclosure portion surrounds the source circuit to shield RF signals while simultaneously providing a thermally conductive path through the heat pipe connection to dissipate heat generated by the source circuit, preventing heat accumulation within the enclosed space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simultaneously shields microwaves and dissipates heat within a limited device space, enhancing operational efficiency and reliability.
Implementation Method 1
a heat pipe having a first region disposed in the recess, a second region opposite to the first region, and a third region extending between the first region and the second region
Implementation Method 2
a heat sink disposed in the second region of the heat pipe
Implementation Method 3
a thermal interface material disposed between the recess of the enclosure portion and the first region of the heat pipe
Implementation Method 4
an enclosure portion surrounding the source circuit on the printed circuit board
Data Source
AI summary
An aerosol-generating device may shield a radio frequency (RF) signal generated from a source circuit of a printed circuit board and dissipate heat generated from the source circuit.