Microwave Sintering Superconductor Joints Without Flux
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Solution Overview
Problem
Conventional methods for joining superconductor materials, such as using copper metal or fluxing agents, lead to increased resistance and energy consumption over time, limiting the length of high-temperature superconductive leads and altering the interface structure, which affects the conductivity and quality of superconductive products.
Innovation Solution
A microwave chamber is used to join superconductor materials by applying pressure and transforming microwave power into thermal energy between heat absorption plates, eliminating the need for additional joining materials and allowing direct bonding without altering the interface structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If copper metal is used to join superconductor materials, then the joining process is simple and feasible, but the resistance value increases over time and energy is consumed
Solution Approach 1:
The patent removes copper metal and fluxing agents from the joining process entirely. By using microwave irradiation to directly sinter the superconductor ceramic materials together, it extracts the harmful intermediate materials that cause resistance and energy loss, achieving direct bonding between superconductor pieces without any assistant joining materials.
Solution Approach 2:
The patent replaces the conventional thermal field joining method with a microwave field-based joining method. Instead of using external heating elements to heat copper or flux materials, microwave energy directly couples with the superconductor materials to achieve rapid heating and sintering, eliminating the need for copper metal assistants and reducing energy loss.
2Length of moving object
If the length of superconductive lead is extended beyond 500 meters, then the transmission distance is improved, but the performance deteriorates due to heat generation from resistance
Solution Approach 1:
By removing copper metal from the joining process, the patent eliminates the source of resistance that causes heat generation. The direct microwave sintering creates bonds without introducing resistive materials, allowing extended lead lengths to maintain their superconductive properties without performance deterioration.
3Temperature
If fluxing agent is used to bond ceramic materials, then the bonding temperature is lowered, but the interface structure is altered and resistance value increases
Solution Approach 1:
The patent extracts fluxing agents from the joining process entirely. By using microwave irradiation to heat the superconductor materials directly to their sintering temperature, it eliminates the need for fluxing agents that would otherwise be required to lower the bonding temperature, thereby avoiding the creation of resistive interface structures.
Solution Approach 2:
The patent changes the heating method from conventional external heating to internal microwave heating. This parameter change allows direct heating of the superconductor materials to their sintering temperature without requiring fluxing agents, maintaining the original interface structure and minimizing resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of longer superconductive leads with maintained zero resistance and high-temperature superconductivity, reducing energy consumption and interface resistance issues, while being cost-effective and fast.
Implementation Method 1
The first heat absorption plate and the second heat absorption plate transform the microwave power into thermal energy so as to join the first superconductor material and the second superconductor material at the overlapping region
Data Source
AI summary
A method of joining superconductor materials is described. A microwave chamber including a first heat absorption plate and a second heat absorption plate corresponding to the first absorption plate is provided. A first superconductor material and a second superconductor material are disposed between the first heat absorption plate and the second heat absorption plate in the microwave chamber. The first superconductor material and the second superconductor material have an overlapping region therebetween, and a pressure is applied to the first heat absorption plate and the second heat absorption plate. Microwave power is supplied to the microwave chamber. The first heat absorption plate and the second heat absorption plate transform the microwave power into thermal energy so as to join the first superconductor material and the second superconductor material at the overlapping region.