Microwave Soldering with Partial Electromagnetic Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
When mounting electronic devices using solder, it is challenging to control the heating temperature and time effectively for components with different heat resistances on the same base, leading to insufficient bonding and reduced production efficiency, especially with microwave heating which uniformly irradiates microwaves.
Innovation Solution
A method involving a partially shielded board where some solder parts are shielded from electromagnetic radiation while others are not, allowing for magnetic field heating to melt and solidify the solder, enabling controlled heating conditions for each electronic device based on its heat resistance, using a microwave standing wave to efficiently heat and bond components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If heating temperature is set to low temperature side to accommodate electronic devices with low heat resistance, then thermal damage to sensitive devices is reduced, but bonding strength between electronic device and base is insufficient and bonding time increases
Solution Approach 1:
The patent applies local quality by introducing electromagnetic shielding structures (such as metal foils or shields) at specific locations around certain solder parts. This creates different heating conditions for different regions: shielded regions experience reduced microwave energy and lower heating, while unshielded regions receive full microwave energy for rapid heating. This resolves the contradiction by allowing low-temperature heating for heat-sensitive devices in shielded regions while maintaining high-temperature rapid bonding capability in unshielded regions.
2Strength
If heating temperature is increased to achieve sufficient bonding strength, then bonding quality improves, but electronic devices with low heat resistance suffer thermal damage
Solution Approach 1:
The patent segments the heating process by spatially dividing the soldering area into shielded and unshielded zones. Each zone can be independently controlled regarding microwave exposure. This segmentation allows different heating temperatures and rates for different electronic devices on the same base, enabling high-temperature rapid bonding for heat-resistant devices while protecting heat-sensitive devices through localized shielding.
3Productivity
If microwave heating is used to achieve rapid and uniform heating, then heating efficiency improves, but uniform irradiation causes all solder parts to heat simultaneously making individual control impossible
Solution Approach 1:
The patent introduces electromagnetic shielding structures as intermediary elements between the microwave source and specific solder parts. These shields act as mediators that selectively block or attenuate microwave energy to specific regions. This allows the system to maintain the overall efficiency of microwave heating while gaining the ability to control heating conditions for individual electronic devices by strategically placing shields around those requiring protected heating.
4Adaptability or versatility
If individual control of heating temperature and time for each electronic device is implemented, then adaptability to different heat resistances improves, but production efficiency and process complexity decrease
Solution Approach 1:
The patent implements preliminary action by pre-configuring electromagnetic shielding structures in fixed positions around specific solder parts before the heating process begins. This pre-arranged shielding configuration automatically provides the required differential heating control without requiring real-time adjustment during processing. The shields are positioned based on the heat resistance characteristics of different electronic devices, enabling adaptive heating while maintaining simple, efficient batch processing suitable for mass production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-efficiency solder mounting of electronic devices with different heat resistances on the same base, minimizing thermal damage and ensuring strong bonding while optimizing production efficiency by controlling the heating conditions for each component.
Implementation Method 1
heating and melting at least the solder parts for which the electromagnetic shielding is not performed by an action of a magnetic field of a standing wave formed by the microwave irradiation
Implementation Method 2
by utilizing magnetic loss or induced current due to the action of the magnetic field rather than the electric field of the standing wave
Implementation Method 3
by utilizing magnetic loss or induced current due to the action of the magnetic field
Implementation Method 4
irradiating with microwaves a board for mounting electronic devices including a base, a plurality of solder parts on the base, and a plurality of electronic devices corresponding to the plurality of solder parts placed in contact with the plurality of solder parts, the microwave irradiation is performed in a state in which electromagnetic shielding is performed for some of the plurality of solder parts
Data Source
AI summary
A method of mounting electronic devices, including the steps of:irradiating with microwaves a board for mounting electronic devices including a base, a plurality of solder parts on the base, and a plurality of electronic devices corresponding to the plurality of solder parts placed in contact with the plurality of solder parts, the microwave irradiation is performed in a state in which electromagnetic shielding is performed for some of the plurality of solder parts; andheating and melting at least the solder parts for which the electromagnetic shielding is not performed by an action of a magnetic field of a standing wave formed by the microwave irradiation.