Modular Microwave Source Embedded Ground Surface
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Solution Overview
Problem
In semiconductor manufacturing, high-frequency plasma sources with dielectric resonators placed in cavities within a dielectric plate suffer from reduced resonant characteristics and coupling efficiency due to the absence of a grounded housing surrounding the resonator, leading to diminished electromagnetic radiation injection into the processing chamber.
Innovation Solution
A conductive ring is electrically coupled to the housing, positioned in the gap between the dielectric resonator and the cavity sidewall, providing a grounded surface that surrounds the resonator, enhancing the coupling of high-frequency electromagnetic radiation and improving plasma uniformity and density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the dielectric resonator is placed in a cavity into the dielectric plate to improve injection of electromagnetic radiation, then the coupling of high-frequency electromagnetic radiation is improved, but the resonant characteristic of the dielectric resonator is diminished due to absence of grounded housing surrounding
Solution Approach 1:
The grounding structure is segmented into two parts: the housing ground surrounding the upper portion of the resonator and the embedded ground surface within the cavity surrounding the lower portion. This segmentation allows each ground structure to perform its function independently, maintaining resonant characteristics while improving electromagnetic radiation coupling into the processing chamber.
2Productivity
If the dielectric resonator is placed in a cavity into the dielectric plate to improve injection of electromagnetic radiation, then the coupling of high-frequency electromagnetic radiation is improved, but the portion of the resonator within the cavity is no longer surrounded by grounded housing
Solution Approach 1:
The embedded ground surface is merged with the dielectric plate by forming a conductive layer directly on the cavity surface, eliminating the need for a separate grounded housing structure. This integration simplifies the overall device structure while maintaining the necessary grounding function for improved electromagnetic radiation coupling.
3Reliability
If a conductive ring is added in the gap to provide grounded surface around the resonator, then the resonant characteristic is improved, but the device complexity increases
Solution Approach 1:
The conductive ring is merged with the housing by forming a continuous conductive layer that extends from the housing into the cavity. This integration creates a seamless grounded structure that maintains resonant characteristics without requiring a separate, complex ring component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the coupling of high-frequency electromagnetic radiation, resulting in enhanced plasma uniformity and density, which in turn improves the uniformity of films deposited and plasma treatments in semiconductor processing tools.
Implementation Method 1
the conductive ring in the gap separating the sidewall of the dielectric resonator from the sidewall of the cavity... providing a grounded surface that surrounds the resonator, enhancing the coupling of high-frequency electromagnetic radiation
Implementation Method 2
A dielectric resonator that is disposed over a dielectric plate... the resonant characteristic of the dielectric resonator
Data Source
AI summary
Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.