Modular Microwave Source Housing for Uniform Plasma Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing high-frequency plasma sources with discrete applicators suffer from plasma non-uniformities and suboptimal electromagnetic radiation coupling due to assembly variations and interfaces between applicators and dielectric plates, leading to inconsistent processing conditions.
Innovation Solution
A monolithic source array is implemented, where dielectric resonators and dielectric plates are fabricated as a single monolithic part, eliminating physical interfaces and assembly variations, and a conductive housing with matched thermal expansion coefficients is used to reduce thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete applicators are positioned over or within a dielectric plate, then the applicators can be installed and replaced individually, but assembly variations and interfaces between applicators and dielectric plate cause plasma non-uniformities
Solution Approach 1:
The patent combines multiple discrete applicators and the dielectric plate into a single monolithic source array structure. This integration eliminates the interfaces between separate components, removing the source of assembly variations and plasma non-uniformities while maintaining the functionality of individual applicator elements within the unified structure.
Solution Approach 2:
The monolithic source array is designed with segmented applicator elements that can be independently configured or modified within the unified structure. This allows for individual adjustment or replacement of specific applicator regions while maintaining the overall integrated structure, balancing adaptability with uniformity.
2Reliability
If applicators are positioned within a cavity into the dielectric plate (not through), then coupling with chamber interior is reduced, but this provides reduced plasma generation efficiency
Solution Approach 1:
The monolithic structure merges the applicator elements directly with the dielectric plate, eliminating the need for separate interfaces or cavities. This direct integration improves electromagnetic radiation coupling and plasma generation efficiency while maintaining the reliability benefits of reduced interface variations.
3Ease of manufacture
If discrete applicators are used with the dielectric plate, then individual component manufacturing is easier, but small variations in assembly and machining tolerances result in plasma non-uniformities
Solution Approach 1:
The patent merges multiple components into a single monolithic structure that is manufactured as one integrated piece. This eliminates assembly operations and the associated tolerances, achieving high manufacturing precision through single-step fabrication processes while maintaining the functional complexity of multiple applicator elements.
4Device complexity
If a single conductive housing is used, then the structure is simpler, but thermal stress from coefficient of thermal expansion mismatch between different materials increases
Solution Approach 1:
The patent employs a composite housing structure with multiple conductive layers, each made from materials with different coefficients of thermal expansion. This composite construction allows each layer to accommodate thermal expansion independently, reducing overall thermal stress while maintaining structural integrity and electrical functionality.
Solution Approach 2:
The housing is segmented into multiple conductive layers that can be independently designed and manufactured. This segmentation allows for optimized material selection in each layer to manage thermal expansion differences, reducing thermal stress without requiring a completely redesigned monolithic housing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The monolithic source array enhances plasma uniformity and improves electromagnetic radiation coupling, reducing assembly-induced non-uniformities and thermal stress, resulting in more consistent and efficient plasma generation.
Implementation Method 1
The coupling of the high-frequency electromagnetic radiation with the interior of the chamber is diminished in part due to the additional interface between the dielectric plate and the applicator
Implementation Method 2
plasma is also generated in the opening in the dielectric plate in the space surrounding the applicator
Implementation Method 3
a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.