Microwave Thermal Processing Substrate Height Control
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Solution Overview
Problem
In semiconductor manufacturing, thermal processing using microwaves faces challenges in controlling heat distribution across substrates due to variations in electromagnetic field distribution, requiring frequent redesign of antennas, which is costly and inefficient.
Innovation Solution
A thermal processing apparatus with a chamber, substrate support unit, and microwave unit that includes a lifting drive mechanism and controller to adjust substrate height based on temperature distribution, using map data learned from simulation or experimental data to position the substrate for precise heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the antenna design is changed to control heat distribution, then the temperature uniformity is improved, but the manufacturing cost and complexity increase due to frequent redesigns
Solution Approach 1:
The patent applies the dynamics principle by making the substrate position adjustable rather than fixed. The lifting drive mechanism enables dynamic adjustment of substrate height relative to the antenna, allowing the system to adapt to different temperature distribution requirements without modifying the antenna design itself. This resolves the contradiction by shifting from static antenna design changes to dynamic position adjustments.
Solution Approach 2:
The patent changes the parameter being adjusted from antenna design characteristics to substrate position (height). By controlling the vertical position of the substrate through the lifting mechanism, the system achieves different heating patterns without altering the antenna structure. This parameter substitution eliminates the need for frequent antenna redesigns while maintaining temperature control capability.
2Manufacturing precision
If the antenna is redesigned for each process condition, then the heating precision is improved, but the production time and cost increase
Solution Approach 1:
The patent implements preliminary action by pre-programming the relationship between substrate positions and expected temperature distributions in the controller. During operation, the system selects and executes pre-determined position settings based on the desired heating pattern, eliminating the need for real-time antenna redesign. This prepares the system in advance to quickly switch between different heating conditions.
Solution Approach 2:
The patent creates a virtual model or map data representing the relationship between substrate position and temperature distribution. Instead of physically redesigning the antenna for each condition, the system uses this copied knowledge model to determine appropriate position adjustments, significantly reducing redesign time and enabling rapid switching between process conditions.
3Device complexity
If a fixed antenna design is used, then the device complexity is reduced, but the ability to control temperature distribution deteriorates
Solution Approach 1:
The patent introduces a new dimension of control by adding vertical movement capability to the substrate positioning system. Instead of controlling temperature distribution through horizontal antenna element adjustments, the system uses the vertical dimension (height adjustment) to achieve different heating patterns. This dimensional shift maintains antenna simplicity while enhancing adaptability.
Solution Approach 2:
The patent introduces the substrate position as an intermediary variable between the fixed antenna and the temperature distribution outcome. By adjusting this intermediary parameter (substrate height), the system achieves versatile temperature control without modifying the antenna design, effectively decoupling the antenna structure from the temperature distribution requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective control of heat distribution across substrates by adjusting substrate height according to temperature differences, ensuring precise thermal processing without the need for frequent antenna redesigns.
Implementation Method 1
a microwave unit that is located at an upper portion of the thermal processing space and forms an electromagnetic field by the microwave in the thermal processing space
Data Source
AI summary
An embodiment of the present disclosure provides a thermal processing apparatus and an operation method thereof capable of controlling a heat distribution of a substrate at a low cost in a thermal processing process using a microwave. According to the present disclosure, a thermal processing apparatus includes a chamber that forms a thermal processing space of a substrate, a substrate support unit that is located at a lower portion of the thermal processing space and supports the substrate, and a microwave unit that is located at an upper portion of the thermal processing space and forms an electromagnetic field by the microwave in the thermal processing space. The substrate support unit includes a chuck fixed at the lower portion of the thermal processing space, a lifting drive mechanism configured to support the substrate with raising and lowering the substrate with respect to the chuck, and a controller that controls the lifting drive mechanism to adjust a height of the substrate based on a temperature distribution for each area of the substrate.