Electronic Package Mold Cap Curing Using Microwave Susceptors

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Solution Overview

Problem

Conventional heating processes for curing mold caps in semiconductor packages are energy-inefficient and costly, leading to higher fabrication costs.

Innovation Solution

A method utilizing microwave radiation and a susceptor with polar materials for hybrid heating, combining direct microwave curing and convection heat transfer to cure the mold cap, reducing energy consumption and improving efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional heating process is used to cure the molding material, then the mold cap is cured and encapsulates the modules, but energy consumption is high and efficiency is low

Engineering Contradiction:

Improveenergy consumptionVSAvoidcuring efficiency

Core Design Contradiction:

Loss of energyVSProductivity

Solution Approach 1:

The patent replaces conventional thermal conduction heating with microwave radiation heating. The susceptor material (containing ferrite or iron oxide particles) converts microwave electromagnetic energy directly into heat through hysteresis loss and eddy current, eliminating the need for external heating elements and thermal conduction pathways. This substitution achieves more direct and efficient energy conversion, reducing energy loss and improving curing efficiency simultaneously.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces polar materials (ferrite or iron oxide particles) into the susceptor at specific concentrations (0.1-10 wt%) to change the magnetic permeability and dielectric properties of the system. This parameter change enables the susceptor to interact effectively with microwave radiation, allowing direct electromagnetic-to-thermal energy conversion. The optimized material parameters achieve rapid and uniform heating while minimizing energy consumption.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If conventional heating process is used, then the molding material is cured, but fabrication cost increases

Engineering Contradiction:

Improvecuring qualityVSAvoidfabrication cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By replacing conventional thermal conduction heating with microwave radiation heating, the patent eliminates energy loss through multiple thermal conduction interfaces and reduces overall energy consumption. The direct electromagnetic-to-thermal energy conversion in the susceptor material shortens processing time and improves curing uniformity, thereby reducing fabrication costs while maintaining or improving curing quality.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The susceptor material containing polar particles serves a dual function: it absorbs microwave energy and converts it to heat, then conducts this heat to cure the molding material. This self-heating mechanism eliminates the need for external heating systems and complex thermal management, simplifying the manufacturing process and reducing equipment costs while ensuring reliable curing.

Inventive Principle:

Principle #25Self-service

3Loss of energy

If microwave radiation is applied through the susceptor, then energy efficiency is improved, but uniform heating must be achieved

Engineering Contradiction:

Improveenergy efficiencyVSAvoidcuring uniformity

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The patent distributes polar particles (ferrite or iron oxide) uniformly throughout the susceptor material at optimized concentrations (0.1-10 wt%). This local distribution ensures that microwave energy is absorbed and converted to heat uniformly across different regions of the susceptor. The homogeneous particle distribution creates consistent local heating zones, preventing hot spots and ensuring uniform heat conduction to the molding material, thereby achieving both high energy efficiency and curing uniformity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves higher energy efficiency and uniform curing with reduced warpage and defects, lowering overall energy demand and fabrication costs.

Implementation Method 1

applying microwave radiation to the mold cap and the susceptor to cure the mold cap at least partially through the susceptor

Methodology Applied

Scientific EffectMicrowave radiation: Microwave Radiation

Implementation Method 2

the susceptor comprises at least a polar material; applying microwave radiation to the mold cap and the susceptor to cure the mold cap at least partially through the susceptor

Methodology Applied

Scientific EffectDielectric heating: Dielectric Heating

Implementation Method 3

combining direct microwave curing and convection heat transfer to cure the mold cap

Methodology Applied

Scientific EffectConvection heat transfer: Convection

Data Source

PatentUS20250246477A1Electronic package and a method for forming the same

Publication Date: 2025.07.31 JCET STATS CHIPPAC KOREA LTD

AI summary

An electronic package and a method for forming the same are provided. The method comprises: providing a substrate having a front surface and a back surface, wherein at least one electronic component is attached onto the front surface of the substrate, and the substrate comprises at least a non-polar material; forming a mold cap on the front surface of the substrate to encapsulate the at least one electronic component; loading the substrate onto a susceptor, wherein the susceptor comprises at least a polar material; and applying microwave radiation to the mold cap and the susceptor to cure the mold cap at least partially through the susceptor.