Thin Film Formation via Microwave-Assisted Particle Fluidization
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Solution Overview
Problem
The existing methods for manufacturing thin films, such as those used in copper interconnections, face challenges in reducing manufacturing costs and ensuring uniform filling of concave portions without high-temperature heat treatment, which can lead to high resistance and breakage issues.
Innovation Solution
A method involving the application of a liquid containing fine particles and a solvent to a substrate, followed by a first heat treatment to evaporate the solvent and a second microwave heat treatment to melt and fluidize the particles, allowing them to fill trenches uniformly, while maintaining a low substrate temperature and using chemical mechanical polishing to form a stable thin film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat treatment is used to convert fine particles to thin film, then thin film can be formed, but high temperatures are required which limits applicable processes and may cause defects
Solution Approach 1:
The invention utilizes phase transition of liquid metal particles from solid to liquid state through controlled heating to 100-200°C, enabling the particles to flow and fill trench concave portions uniformly, then solidifies upon cooling to form continuous thin film interconnections without requiring high-temperature conventional heat treatment
Solution Approach 2:
The invention changes the temperature parameter from conventional high-temperature heat treatment to low-temperature range of 100-200°C, and changes the state parameter of metal particles from solid powder to liquid state through controlled heating, enabling uniform filling and film formation under milder conditions
2Ease of manufacture
If ultrafine particles are used to fill concave portions, then thin film can be formed without vacuum equipment, but uniform filling is difficult which may lead to high resistance areas or breaks
Solution Approach 1:
The invention utilizes phase transition of metal particles from solid to liquid state through controlled heating, enabling the particles to flow and fill trench concave portions uniformly, then solidifies upon cooling to form continuous thin film interconnections without requiring high-temperature conventional heat treatment
Solution Approach 2:
The invention uses a liquid carrier medium as an intermediary to disperse and transport liquid metal particles into the trench concave portions, ensuring uniform distribution and filling, then the carrier is evaporated leaving behind the continuous metal film
3Reliability
If high-temperature heat treatment is applied to convert fine particles to thin film, then film formation is achieved, but the substrate temperature becomes high which may damage temperature-sensitive components
Solution Approach 1:
The invention utilizes phase transition of liquid metal particles from solid to liquid state through controlled heating to 100-200°C, enabling the particles to flow and fill trench concave portions uniformly, then solidifies upon cooling to form continuous thin film interconnections without requiring high-temperature conventional heat treatment
Solution Approach 2:
The invention replaces conventional thermal energy-based high-temperature heat treatment with a controlled low-temperature heating process that utilizes phase transition of liquid metal particles, achieving film formation through state change rather than high-temperature thermal processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, ensures uniform filling of trenches, prevents defects like voids, and maintains a low substrate temperature, resulting in thin films with uniform resistance and crystal grain sizes greater than the interconnection width, thus enhancing the reliability of copper interconnections.
Implementation Method 1
a liquid carrier having fine particles dispersed therein is applied to a surface
Implementation Method 2
the liquid carrier is evaporated
Implementation Method 3
the fine particles are heated by using microwave irradiation
Implementation Method 4
heating the fine particles by using microwave irradiation. At least one of the trench and the concave portion is filled with the thin film containing the fine particles
Data Source
AI summary
A method for manufacturing a thin film includes: applying a liquid to a surface of a processing target member having at least one of a trench and a concave portion. The liquid includes a solvent and at least one of fine particles of a metal, fine particles of a semiconductor, fine particles containing a metal oxide, and fine particles containing a semiconductor oxide. A first heat treatment is included for volatilizing the solvent of the liquid applied to the surface of the processing target member. The fine particles are remained on the surface of the processing target member. A second heat treatment is also included for heating the fine particles by using microwave irradiation. At least one of the trench and the concave portion is filled with the thin film containing the fine particles or a component of the fine particles.