Microwave Mounting Wiring Board With Heat Generation Pattern
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Solution Overview
Problem
Microwave heating methods face challenges in efficiently mounting electronic devices of varying sizes due to uneven heating and potential damage, particularly when using microwave irradiation, as smaller components may not absorb enough energy for complete solder melting, and the efficiency is affected by the base type and thickness.
Innovation Solution
A mounting wiring board with a heat generation pattern on the electrode portion, using a dielectric base and a magnetic or conductive heat generation pattern, is heated by a standing wave microwave to efficiently melt solder and mount electronic devices without damaging the base or components, utilizing a microwave heating apparatus with a cavity resonator to control heating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microwave irradiation is used for heating solder, then heating time is reduced and heating efficiency is improved, but smaller electronic components do not absorb enough microwave energy resulting in insufficient solder melting
Solution Approach 1:
A heat generation pattern made of magnetic powder or ferrite is introduced as an intermediary substance between the microwave field and the solder. This intermediary absorbs microwave energy and converts it to heat, which is then transferred to the solder, ensuring reliable solder melting even for small components that would otherwise not absorb enough microwave energy directly
Solution Approach 2:
The invention changes the heating mechanism from direct microwave absorption by solder to indirect heating via a heat generation pattern with specific magnetic properties. By controlling the material composition (magnetic powder concentration, ferrite type) and physical parameters (pattern thickness, area) of the heat generation pattern, the heating efficiency and temperature distribution can be optimized for components of various sizes
2Stability of the object's composition
If conventional heating methods are used, then uniform heating is achieved, but heating time is excessive and thermal damage may occur
Solution Approach 1:
The heat generation pattern is designed with specific local properties (material composition, thickness, area) that enable it to generate heat uniformly across the solder region. The magnetic powder concentration and ferrite material are selected to ensure uniform microwave absorption and heat distribution, achieving both speed and uniformity
Solution Approach 2:
The invention uses standing wave microwaves with specific frequency and time-controlled irradiation. By optimizing the microwave irradiation time and using the periodic nature of electromagnetic waves, efficient heating is achieved without excessive thermal exposure that could cause damage
3Adaptability or versatility
If microwave heating is applied to electronic devices of various sizes, then mounting versatility is improved, but difference in heating histories causes inconsistent solder melting
Solution Approach 1:
The heat generation pattern is designed as a universal heating solution that can accommodate electronic devices of various sizes. By adjusting the pattern area, magnetic powder concentration, and ferrite material selection, the same basic structure serves multiple component sizes, ensuring consistent solder melting quality across different device scales
Solution Approach 2:
The invention controls heating consistency by adjusting parameters of the heat generation pattern including magnetic powder concentration (5-50 wt%), pattern thickness (1-100 μm), and area relative to component size. These parameter adjustments enable optimized heating for different component sizes while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for high-efficiency, low-damage mounting of electronic devices of various sizes by controlling heating through a heat generation pattern and base material selection, ensuring uniform solder melting and reducing thermal stress on the base.
Implementation Method 1
the temperature increases in a short time due to a magnetic loss caused by an action of a magnetic field generated by the microwave irradiation
Implementation Method 2
or due to an induced current excited in metal particles by the action of the magnetic field
Implementation Method 3
A heat conduction occurs from the heat generation pattern with the increased temperature to the solder on a conductive pattern printed on the base
Implementation Method 4
heating a heat generation pattern in a predetermined shape disposed on a support by microwave irradiation
Implementation Method 5
using a standing wave microwave to efficiently melt solder
Data Source
Figure 1(A)~2
Figure 3~4
Figure 5(A)~5(B)
AI summary
A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion; an electronic device mounting board using the mounting wiring board; a method of mounting the electronic device; a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; and a microwave heating apparatus.