Microwire Circuit Deposition System for Low-Impedance Traces
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Solution Overview
Problem
Current systems for depositing dielectric and conductive materials in electrical circuits, such as those used in system-in-package devices and on conformal surfaces, face challenges with high resistance and mechanical weakness in conductive traces, which can affect power and impedance-sensitive signals.
Innovation Solution
A microcircuit deposition system that uses a microwire spooling machine with a tension guide to position thin, uninsulated copper wires onto a substrate, followed by direct-write deposition of dielectric and conducting materials to create high-quality, low-impedance traces with superior mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct-write processes use inks and pastes with nano-sized particles to deposit conductive traces, then the manufacturing process is simple and adaptable, but the traces exhibit significant resistance and weaker mechanical properties
Solution Approach 1:
The deposition system is divided into multiple specialized modules: a first printing engine for dielectric deposition, a microwire spooling machine for precise wire placement, and a second printing engine for covering dielectric. Each module performs a specific function, allowing the system to achieve high trace quality through specialized processes while managing overall complexity through functional segmentation.
Solution Approach 2:
The micrawire is positioned and deposited onto the substrate before the final dielectric layers are applied. This preliminary placement of the high-quality conductive element allows subsequent processing steps to protect and integrate it properly, ensuring low resistance and strong mechanical properties from the outset.
2Reliability
If micrawire is deposited onto a substrate, then lower impedance and stronger mechanical properties are achieved, but the deposition process becomes more complex
Solution Approach 1:
Dielectric layers serve as intermediary materials that facilitate the integration of micrawire into the circuit. The first dielectric layer provides a stable base for micrawire deposition, while the second dielectric layer protects and insulates the wire. These intermediary layers simplify the manufacturing process by enabling standard deposition techniques while achieving superior mechanical properties through the micrawire-dielectric composite structure.
3Manufacturing precision
If multiple printing engines and spooling machines are used for micrawire deposition, then trace quality improves, but the system complexity increases
Solution Approach 1:
The printing engines are designed to perform multiple functions: depositing dielectric materials, preparing surfaces for micrawire adhesion, and providing structural support during the deposition process. This multi-functionality allows the system to achieve high manufacturing precision with relatively standardized components, reducing overall system complexity while maintaining trace quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves lower impedance and stronger mechanical properties for the conductive traces, reducing resistance and enhancing the reliability of electrical circuits, particularly in applications like UAVs and SIP devices where discrete wiring is minimized.
Implementation Method 1
A micrawire spooling machine houses a micrawire spool and incorporates a tension guide to position a micrawire trace onto the dielectric layer
Implementation Method 2
A first printing engine deposits a dielectric on a substrate. A second printing engine trails the micrawire spooling machine to deposit a covering dielectric layer over the micrawire trace
Data Source
AI summary
A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.