MID Base Member Projection with Corner Protrusions
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Solution Overview
Problem
Conventional molded interconnect device (MID) packages for sensor modules have large dimensions, hindering miniaturization of electronic devices and leaving dead space when accommodated, which is undesirable for miniaturized electronic devices.
Innovation Solution
A small-sized base member with a molded interconnect device (MID) technique, featuring pattern wiring directly formed on a projection with protrusions on both sides, allowing for efficient accommodation in electronic devices by reducing height and minimizing contact with other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional MID package with triangular pyramidal shape is used, then the sensor module can be manufactured with standard structure, but the height, width, and thickness become large, hindering device miniaturization
Solution Approach 1:
The patent transitions from a three-dimensional triangular pyramidal structure to a two-dimensional planar structure with a projection. This dimensional simplification reduces the height and thickness of the package while maintaining the necessary functional areas for sensor mounting and wiring, directly addressing the miniaturization requirement.
Solution Approach 2:
The patent employs a projection with rounded corners instead of sharp angular edges. This curvature design minimizes dead space when the package is accommodated in electronic devices, allowing for more efficient space utilization and reducing the overall package footprint.
2Ease of manufacture
If a triangular pyramidal MID package is used, then the structure is simple to manufacture, but dead space is left inside the device during accommodation
Solution Approach 1:
The projection features rounded corners that conform to the contours of available mounting spaces in electronic devices. This curved geometry eliminates angular dead spaces that would otherwise remain unused, maximizing the utilization of the available area while keeping the manufacturing process straightforward.
3Device complexity
If pattern wiring is laid directly on the projection top without protective features, then the structure remains simple, but the wiring is vulnerable to disconnection from contact with other members or tools
Solution Approach 1:
The patent incorporates protrusions at the corners of the projection top before the wiring is laid. These protrusions serve as protective cushions that prevent tools and other members from directly contacting and potentially disconnecting the pattern wiring during assembly and handling operations, thereby enhancing reliability without significantly complicating the structure.
4Volume of moving object
If the base member height is reduced for miniaturization, then the device size decreases, but the wiring becomes more susceptible to damage from external contact
Solution Approach 1:
By incorporating protective protrusions at the corners of the projection top, the patent provides beforehand cushioning that shields the pattern wiring from external contact. This protective feature is integrated into the base member structure itself, allowing for height reduction while maintaining wiring reliability through the corner protrusions that prevent direct contact with tools and other members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the miniaturization of sensor modules by reducing the height of the base member and minimizing the risk of disconnection due to contact with other members or tools, facilitating better integration and functionality in compact electronic devices.
Implementation Method 1
The MID technique is a technique for irradiating predetermined locations of a base member with laser and forming a coating of metal plating only on the irradiated portions
Data Source
AI summary
A base member that is a molded part on which pattern wiring is directly formed, includes a projection projecting from a base surface of the base member. The pattern wiring is laid over a top of the projection, and protrusions are molded on both sides of an area at the top of the projection where the pattern wiring passes.