Molded Interconnect Device Camera Housing for Thermal and EMC Integration
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Solution Overview
Problem
Current vehicle vision systems using imaging sensors lack efficient and cost-effective camera housing designs that integrate electrical conducting structures and heat dissipation, which can impact the performance and reliability of the imaging systems.
Innovation Solution
The use of Molded Interconnect Device (MID) technology to create camera housings with integrated electrical conducting structures and heat dissipation, allowing for direct mounting of electronic components and optional additional PCBs, enhancing electromagnetic compatibility (EMC) shielding and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional camera housing designs are used, then manufacturing costs and assembly complexity increase, but integrating electrical conducting structures and heat dissipation functions is achieved
Solution Approach 1:
The patent combines multiple functions (housing structure, electrical conducting structures, and heat dissipation) into a single integrated camera housing component. The housing includes conductive regions for electromagnetic shielding and heat dissipation regions working together as unified structures, eliminating the need for separate components and reducing assembly steps.
Solution Approach 2:
The camera housing is designed to perform multiple functions simultaneously: structural support, electromagnetic shielding through conductive regions, and heat dissipation through dedicated regions. This multi-functional design reduces the total number of components needed and simplifies the overall system architecture.
2Reliability
If electrical conducting structures are added for EMC shielding, then electromagnetic compatibility improves, but heat dissipation capability deteriorates
Solution Approach 1:
The housing is designed with spatially differentiated regions: conductive regions positioned to provide electromagnetic shielding in specific areas, and heat dissipation regions positioned to maximize thermal management. This local specialization allows each function to be optimized independently within the unified housing structure.
Solution Approach 2:
The housing is segmented into distinct functional regions including conductive regions for EMC shielding and heat dissipation regions for thermal management. These segmented regions work independently but are integrated into a single housing structure, allowing optimized performance for each function.
3Reliability
If multiple separate components are used for housing, conducting structures, and heat dissipation, then functional performance improves, but assembly complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the housing structure, electrical conducting structures, and heat dissipation components into a single integrated camera housing. This consolidation maintains all necessary functional performances while reducing the number of separate components and simplifying the assembly process.
Solution Approach 2:
The unified housing structure performs multiple functions simultaneously: structural support, electromagnetic shielding, and heat dissipation. This multi-functional design eliminates the need for separate dedicated components for each function, reducing overall system complexity while maintaining functional performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a robust and cost-effective camera housing that improves the performance and reliability of vehicle vision systems by integrating electrical conducting structures and heat dissipation, enabling efficient image capture and processing while reducing manufacturing costs.
Implementation Method 1
The camera may not include a PCB or may have some of the electronic components borne by the MID structure and one or more additional PCBs may be attached to the lead frame routing structure of the housing by reflow soldering, press fit, welding or bonding or the like
Implementation Method 2
The present invention provides a camera housing with its inner surface having electrical conducting structures made by molded interconnect device (MID) technology
Data Source
AI summary
A method of assembling a vehicular camera includes providing a front housing and a rear housing and accommodating a lens assembly at the front housing. The rear housing includes first structure and second structure at an interior portion thereof. The rear housing includes electrically connecting elements established at and between the first structure and the second structure via molded interconnect device (MID) technology. A first printed circuit board has first circuitry that electrically connects to electrical contacts at the first structure. A second printed circuit board has second circuitry that includes an imager and that is in electrical connection with the electrical contacts at the second structure. An electrical connector at the rear housing electrically connects to circuitry of at least one of the first and second printed circuit boards. The front housing is mated with the rear housing to house the first and second printed circuit boards.