Injection-Molded Circuit Mounts for Compact Sample Analysis Devices
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Solution Overview
Problem
Existing analysis devices for sample analysis on test elements require a large number of individual components for electrical contact, leading to increased assembly effort, longer tolerance chains, and restricted design freedom, resulting in larger form factors.
Innovation Solution
The use of three-dimensional injection-molded circuit mounts (MID components) for making electrical contact, which can take the form of sprung, plug, sliding, or solder contacts, integrating conductor tracks and metallic structures within injection-molded plastic to reduce the number of components and enhance design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional separate components are used for electrical contact, then reliable electrical connection is achieved, but the number of components increases and assembly complexity increases
Solution Approach 1:
The patent combines multiple separate electrical contact components into a single integrated circuit mount made of electrically conductive material. This circuit mount simultaneously provides electrical connection to the heating element, temperature sensor, and other components, eliminating the need for multiple separate contacts while maintaining reliable electrical connectivity through the integrated conductive structure.
2Reliability
If multiple separate components are used for electrical contact, then electrical connection is established, but assembly effort increases
Solution Approach 1:
The circuit mount integrates multiple electrical contact functions into a single component that is molded as one piece with the housing. This integration eliminates multiple assembly steps for installing separate contacts, reducing assembly effort while ensuring reliable electrical connections through the pre-integrated conductive pathways.
3Use of energy by moving object
If traditional electrical contact components are used, then electrical power transmission is achieved, but the form factor increases
Solution Approach 1:
The circuit mount merges electrical contact functions into the housing structure itself, eliminating the need for separate external contact components. This integration reduces the overall device volume by utilizing the existing housing space for dual purposes: structural support and electrical conduction, thereby maintaining power transmission capabilities while reducing form factor.
4Reliability
If separate electrical contact components are used, then electrical connection is made, but design freedom is restricted
Solution Approach 1:
The integrated circuit mount allows the electrical contact design to be freely configured within the housing structure without being constrained by separate standardized components. The conductive material can be shaped and positioned optimally for each specific application, providing greater design freedom while ensuring reliable electrical contacts through the integrated structure.
Data Source
AI summary
An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.