MID Component Carrier for Flexible PCB Assembly
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Solution Overview
Problem
Automated population of circuit boards with electrical components is complicated by individual connections, limited installation space, and temperature sensitivity, making it difficult to swap components and manage heat effectively.
Innovation Solution
A component carrier made of electrically insulating material, using the MID and LDS methods, with a base region for mechanical connection and a flat connecting portion for component assembly, featuring traces that can be soldered to the circuit board, enabling flexible component placement and reducing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individual connections are used for electrical components, then component functionality is achieved, but automated population and component swapping become complicated
Solution Approach 1:
The patent introduces a component carrier as an intermediary element between the circuit board and individual electrical components. The carrier provides a standardized interface with the circuit board while accommodating various components with individual connections, thereby enabling automated population and component swapping without modifying the circuit board layout.
2Productivity
If SMT soldering is used for automated population, then productivity is improved, but temperature-sensitive components cannot be soldered
Solution Approach 1:
The patent segments the soldering process into two distinct stages: first, the component carrier is soldered to the circuit board using SMT (which can withstand high temperatures), and second, the temperature-sensitive electrical components are attached to the carrier using low-temperature methods. This segmentation allows automated high-speed SMT processing while protecting sensitive components from excessive heat.
3Area of stationary object
If installation space on circuit board is minimized, then space utilization is improved, but heat dissipation from powerful components becomes problematic
Solution Approach 1:
The patent moves powerful heat-generating components from the two-dimensional circuit board plane to a third dimension by mounting them on vertical component carriers. The carriers extend perpendicular to the board surface, allowing components to be positioned above the board rather than on it. This spatial relocation maintains compact board area while improving heat dissipation through increased air circulation and separation from heat-sensitive board areas.
Data Source
AI summary
Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.