Molded Interconnect Device for Head Mounted Display Signal Integrity

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Solution Overview

Problem

Head-mounted displays (HMDs) face challenges with assemblability and signal interference due to flexible circuit boards encircling the frame, leading to noise issues as devices become smaller and lighter, with insufficient countermeasures in existing technologies.

Innovation Solution

The use of Molded Interconnect Devices (MIDs) to form electrical connections and shield surfaces within the resin casing, reducing parasitic capacitance and crosstalk by integrating electrode patterns and ground connections, allowing for stable image display and compliance with EMI standards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If flexible circuit boards are used to connect control board and circuit board, then electrical connection is achieved, but assemblability deteriorates and signal interference occurs

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidassemblability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent integrates the flexible circuit board and the frame into a single unified structure. The flexible circuit board is embedded within the frame, eliminating the need for separate assembly steps and improving manufacturability while maintaining reliable electrical connections between the control board and circuit board.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If flexible circuit boards encircle the frame, then electrical connection between temporal regions is achieved, but device complexity increases and noise interference worsens

Engineering Contradiction:
Improveelectrical connectionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The flexible circuit board is merged with the frame structure, creating a single integrated component rather than separate parts. This reduces device complexity by eliminating the need for additional mounting brackets, fasteners, and assembly steps while maintaining the electrical connection function.

Inventive Principle:
Principle #5Merging (Combining)

3Shape

If flexible circuit boards overlap each other, then spatial arrangement is achieved, but signal interference increases

Engineering Contradiction:
Improvespatial arrangementVSAvoidsignal interference
Core Design Contradiction:
ShapeVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a frame structure as an intermediary that separates and organizes the flexible circuit boards. The frame acts as a physical barrier and signal shield, preventing direct overlap and interference between adjacent circuit boards while maintaining their spatial arrangement within the HMD device.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances assemblability and reduces noise interference, enabling stable image quality and compliance with electromagnetic interference standards, while allowing for further miniaturization and complex surface integration.

Implementation Method 1

reducing parasitic capacitance and crosstalk by integrating electrode patterns and ground connections

Methodology Applied
Scientific EffectParasitic capacitance reduction: Capacitance

Implementation Method 2

allowing for stable image display and compliance with EMI standards

Methodology Applied
Scientific EffectElectromagnetic interference shielding: Faraday Cage

Data Source

PatentUS20240337851A1Head mounted display
Publication Date: 2024.10.10 CANON KK
  • US20240337851A1 patent drawing
  • US20240337851A1 patent drawing
  • US20240337851A1 patent drawing

AI summary

Provided is a head mounted display in which noise such as crosstalk caused by signal interference can be reduced. The head mounted display having a frame connecting left and right temporal regions includes a first wiring configured to be formed in the frame using an MID so as to perform electrical connection between a control board disposed on one temporal region side and a circuit board disposed on the other temporal region side.