Molded Interconnect Device Imager Module with VCM
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Imaging systems in compact user devices like smartphones face challenges due to limited space and vulnerability to vibration and mechanical shock, requiring innovative packaging solutions to integrate image sensors and lenses effectively.
Innovation Solution
The use of molded interconnect device (MID) packaging with integrated lenses and voice coil motors, allowing for a compact form factor and reduced height, along with sandwich molded packaging that integrates all imager module components, eliminating the need for a separate lens assembly and daughter board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional separate lens assembly and daughter board are used, then ease of manufacture is improved, but device complexity and volume increase
Solution Approach 1:
The patent merges the lens assembly, image sensor, and daughter board into a single integrated imager module package. The lens is directly mounted on the package substrate, the image sensor is coupled to the substrate, and all electrical connections are made through the substrate itself, eliminating the need for separate daughter boards and reducing overall device complexity while maintaining manufacturability
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it acts as the mounting platform for the lens, provides electrical connections for the image sensor, serves as the circuit board replacing the daughter board, and provides mechanical support for the entire imager module. This multi-functionality reduces the number of separate components needed
2Volume of moving object
If compact form factor is achieved through integration, then volume is reduced, but reliability under mechanical stress deteriorates
Solution Approach 1:
The patent incorporates a vibration damping member within the package structure that is positioned between the image sensor and the package substrate. This member provides beforehand cushioning against mechanical shock and vibration, protecting the fragile image sensor from damage while maintaining the compact integrated form factor
3Ease of manufacture
If integrated packaging is used, then manufacturing cost is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary alignment and mounting of the lens on the package substrate during the package fabrication process itself, before the image sensor is installed. This preliminary action ensures precise positioning is achieved during manufacturing, and the aligned structure is then protected by the integrated packaging, maintaining precision while reducing overall manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more compact, cost-effective, and reliable imager module design that withstands mechanical stress while maintaining high mechanical and electrical functionality, enabling efficient image capture in constrained device spaces.
Implementation Method 1
a voice coil motor (VCM) mounted thereon and electrically connected to the MID package to control the position of the lens relative to the image sensor
Data Source
AI summary
An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package.