MID/LDS Photoelectric Module Layout for Compact Signal Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing design of circuit boards in connectors is limited by space constraints and longer production cycles, making it difficult to achieve miniaturization and multi-functionality in electronic devices.
Innovation Solution
A signal transmission device utilizing molded interconnect device (MID) and laser direct structuring (LDS) technology, where a carrier with integrated optical and electrical modules is fixed within a shielding shell using buckles and card slots, optimizing space utilization and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a PCB circuit board is used to realize circuit connection and signal transmission, then the circuit connection function is achieved, but the design space is limited and production cycle is longer
Solution Approach 1:
The patent integrates the optical module, electrical module, and carrier into a single photoelectric conversion module assembly. The carrier serves as both structural support and circuit board function, merging multiple components into one integrated unit that reduces design space while maintaining all necessary functions.
Solution Approach 2:
The carrier is designed to perform multiple functions simultaneously: it provides mechanical support for mounting the optical and electrical modules, serves as the circuit board for electrical connections, and acts as the structural base for the entire photoelectric conversion module. This multi-functionality eliminates the need for separate PCB and mounting structure.
2Area of stationary object
If traditional PCB circuit board design is used, then circuit layout is achieved, but space utilization is inefficient
Solution Approach 1:
The patent transitions from traditional two-dimensional PCB circuit layout to a three-dimensional integrated structure. The carrier extends vertically to accommodate both optical and electrical modules in different spatial layers, utilizing vertical space rather than only horizontal plane, thereby improving space utilization efficiency.
Solution Approach 2:
The electrical module is nested within the carrier structure, with the optical module positioned above it. The carrier contains both modules in a nested arrangement, maximizing space utilization by placing components in three-dimensional space rather than spreading them out on a flat surface.
Data Source
AI summary
The present disclosure describes a signal transmission device based on molded interconnect device and laser direct structuring (MID/LDS) technology, comprising: a shielding shell (1); and a photoelectric conversion module (2), which includes a carrier (21), an electrical module (22) and an optical module (23). The photoelectric conversion module (2) is fixed inside the shielding shell (1), wherein the first recessed structure (201) accommodates a driving chip (211), a photoelectric conversion chip (212) and an optical module (23), and the second recessed structure (202) accommodates an electrical module (22), the driving chip (211), the photoelectric conversion chip (212) and the conductive terminal (215) are electrically connected to each other, and the carrier (21) is designed by integral molding based on the MID/LDS technology. In t present disclosure, the design space in the shielding shell can be effectively saved.