MID Pressure Sensor Component with Integrated Conductor Tracks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing pressure sensor solutions are limited to absolute pressure measurement and are not suitable for universal application, as they lack compactness, ease of handling, and economical manufacturing, particularly for differential and relative pressure measurements.
Innovation Solution
A compact pressure sensor component featuring a trough-shaped MID housing with integrated conductor tracks and a pressure sensor element, allowing for easy mounting and electrical contacting, and capable of absolute, differential, and relative pressure measurements through a modular design with a second plate-shaped housing part and structured metallization for cost-effective mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressure sensor is enclosed in a closed housing with a protective membrane and pressure transmitter medium, then the sensor is protected against corrosive pressure medium, but the device becomes complex and is only suitable for absolute pressure measurement
Solution Approach 1:
The patent merges the housing, conductor track carrier, and mounting structure into a single integrated trough-shaped component. The conductor tracks are directly formed on the carrier surface of the housing, eliminating the need for separate capsule structures, protective membranes, and transmitter media while maintaining corrosion protection through the housing material itself.
Solution Approach 2:
The pressure sensor device is designed with a universal housing structure that can accommodate different sensor elements and mounting configurations. The trough-shaped housing with integrated conductor tracks and mounting provisions enables the same basic structure to serve multiple functions: structural support, electrical connection, sensor mounting, and environmental protection.
2Ease of operation
If the electrical contact is made via chip carrier with leadframe routed to outside, then the sensor can be mounted and contacted on a printed circuit board, but the device structure becomes more complex
Solution Approach 1:
The housing and conductor track carrier are merged into a single integrated component. The conductor tracks are directly formed on the carrier surface of the housing, eliminating the need for separate leadframes and complex routing structures while maintaining ease of mounting and electrical contacting.
3Ease of manufacture
If an MID housing part with integrated conductor tracks is used, then the component becomes compact and easy to manufacture, but the manufacturing process requires structured metallization and injection molding
Solution Approach 1:
The patent replaces traditional mechanical assembly processes with injection molding technology. The housing with integrated conductor tracks is formed as a single piece through injection molding, eliminating the need for separate mechanical assembly steps and reducing overall device complexity despite the specialized metallization process.
4Ease of operation
If the first housing part wall protrudes beyond the second housing part, then the end areas of conductor tracks are accessible for electrical contacting and mechanical fastening, but the overall device volume increases
Solution Approach 1:
The conductor track end areas are positioned on the protruding wall portion of the housing, utilizing the vertical dimension rather than requiring additional horizontal space. This allows electrical contacts to be accessible from the side while maintaining a compact overall device footprint.
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to pressure sensor components. These are characterized in particular by their simple and compact design and universal applicability. A first trough-shaped housing part, serving as a carrier for conductor tracks and the pressure sensor element, is advantageously a MID housing part (MID = molded interconnect device), so that this housing part itself acts as a circuit carrier. The first housing part has at least one support surface on which the at least one pressure sensor element is located. The support surface, which is a component of the first housing part, has at least one opening for the pressure sensor element, the opening being located in the bottom region of the first housing part.In the first housing part, either a second plate-shaped housing part or a body is arranged, wherein the wall of the first housing part projects beyond the second housing part or the body, and conductor tracks either on the edge surface of the wall of the first housing part or encompassing a wall area and thus ending on an outer wall area of the first housing part are simultaneously connection contacts.