MID Connection Section Layout for Solder Spread Control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The quality of soldering in Molded Interconnect Devices (MID) is compromised due to positional accuracy issues in laser processing, leading to reduced solder quality, damage to conductor patterns, and defective bonding caused by solvent components and insulating resin foreign matter.

Innovation Solution

An electronic component mounting substrate with a connection section featuring a high-wettability region and a low-wettability region, where the low-wettability region has an extension region extending to the peripheral edge and a spaced region projecting towards the high-wettability region, formed by laser processing to expose a low-wettability metallic layer, preventing solder spreading and ensuring accurate solder application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If laser processing is conducted to completely separate the conductor pattern to prevent solder wetting and spreading, then solder spreading is prevented, but positional accuracy issues cause damage to conductor patterns and reduce soldering quality

Engineering Contradiction:

Improvesolder spreadingVSAvoidconductor pattern integrity

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The invention applies local quality by creating a low-wettability region with specific spatial characteristics (extension region reaching peripheral edge and spaced region projecting toward the conductor pattern) that selectively prevents solder spreading only where needed while leaving the conductor pattern intact. This localized approach avoids the harmful effects of complete conductor pattern separation.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The low-wettability region acts as an intermediary barrier between the solder and the conductor pattern. Instead of directly separating the conductor pattern, this intermediate structure with controlled wettability properties prevents solder from reaching and damaging the conductor pattern while maintaining manufacturing precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If laser processing is applied to the ground resin to prevent solder spreading, then solder wetting is controlled, but solvent components enter the processed portion causing loss of active force during soldering

Engineering Contradiction:

Improvesolder wetting controlVSAvoidsoldering bonding quality

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The low-wettability region is designed with specific local characteristics (extension region and spaced region) that control solder wetting only in the necessary areas. This localized wettability control prevents excessive solder spreading while minimizing the affected area where solvent components could penetrate and compromise bonding quality.

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If laser processing is conducted with high precision to maintain conductor pattern integrity, then manufacturing precision is improved, but processing time increases and productivity decreases

Engineering Contradiction:

Improveconductor pattern integrityVSAvoidprocessing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The invention extracts the laser processing from the conductor pattern area and relocates it to create the low-wettability region instead. By taking out the processing from the critical conductor pattern zone and applying it to form the spaced region with controlled wettability, the method maintains high manufacturing precision while reducing processing time and improving productivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances soldering quality by restricting solder spread, maintaining positional accuracy, and preventing damage to conductor patterns, thereby improving the reliability and density of electronic component mounting.

Implementation Method 1

removing part of a first metallic layer by laser processing to expose a second metallic layer lower in wettability than the first metallic layer

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

a solvent component including flux enters the laser processed portion by a capillary phenomenon

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS12256491B2Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus

Publication Date: 2025.03.18 SONY GROUP CORP

AI summary

An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the terminal is fixed through the solder, and a second region lower in wettability than the first region, and the second region has an extension region extended to a peripheral edge of the connection section, and a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge.