Midboard Cable Connector With Superelastic Tips for Signal Integrity
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Solution Overview
Problem
Existing electrical connector systems face challenges in efficiently routing high-speed signals with high signal integrity, particularly in compact electronic devices where space is limited and signal attenuation is a concern.
Innovation Solution
The development of a connector assembly featuring superelastic conductive materials for contact tips, coupled with conductive couplers that mechanically secure the contact tips to cable conductors, and a housing design that allows for efficient signal routing and grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cables are used to route high-speed signals, then signal integrity is improved, but device complexity increases due to additional connectors and cable assemblies
Solution Approach 1:
The conductive coupler integrates multiple functions within a single component: it mechanically couples the contact tip to the cable conductor, provides electrical connection, and offers structural support. This nested integration reduces the number of separate parts needed in the connector assembly.
Solution Approach 2:
The patent combines the mechanical coupling function and electrical connection function into a single conductive coupler component. This merging of functions simplifies the overall connector assembly while maintaining high-speed signal integrity through the use of superelastic contact tips.
2Reliability
If superelastic conductive materials are used for contact tips, then contact force consistency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the unique properties of superelastic materials, changing the material parameter from conventional elastic materials to superelastic materials. This parameter change enables consistent contact force over a wide range of deflections, improving reliability while the patent provides specific guidance on material selection to manage manufacturing precision requirements.
3Volume of moving object
If compact connector designs are implemented, then space utilization is improved, but signal attenuation increases over long distances
Solution Approach 1:
The patent employs superelastic conductive materials that combine high electrical conductivity with compact dimensions. The conductive coupler integrates multiple materials and functions to achieve both compact size and low signal loss, allowing space-efficient designs without sacrificing signal integrity over long distances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable, high-density interconnections with consistent contact force, even in compact designs, thereby maintaining high signal integrity and reducing signal attenuation over long distances.
Implementation Method 1
a first contact tip including a superelastic conductive material configured to mate with a first signal contact of a circuit board
Data Source
AI summary
Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.