Midboard Cable Connector With Superelastic Contacts for High-Speed Signals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic systems face challenges in efficiently routing high-speed signals with high signal integrity due to signal attenuation when using traditional printed circuit board connections, which limits the distance and density of connections in compact electronic devices.
Innovation Solution
The development of a midboard connector assembly using superelastic conductive materials and a pressure mount interface with a camming structure, which includes a housing with angled surfaces to generate mating force without mechanical components, and a connector design that inhibits sliding motion between cable conductors and insulative structures, ensuring reliable and high-density interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional printed circuit board connections are used to route high-speed signals, then the system structure is simple and manufacturing is easy, but signal attenuation increases and transmission distance is limited
Solution Approach 1:
The patent introduces cables as an intermediary component to route high-speed signals between printed circuit boards. These cables with controlled impedance conductors serve as a mediator that provides a lower-loss transmission path compared to traditional PCB traces, thereby reducing signal attenuation while maintaining system manufacturability through standardized connector interfaces
Solution Approach 2:
The patent replaces mechanical PCB trace connections with a cable-based transmission system. This substitution uses flexible cable assemblies with dedicated signal conductors and shielding, replacing the rigid mechanical trace structure on PCBs, thereby achieving better signal integrity for high-frequency applications while allowing greater design flexibility
2Reliability
If cable connections are used to route high-speed signals, then signal integrity improves and transmission distance increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the signal transmission path into distinct modular components: connector assemblies mounted on PCBs, flexible cable assemblies with controlled impedance conductors, and intermediate mating interfaces. This segmentation allows each component to be manufactured and tested independently using specialized processes, then assembled into a complete high-speed signal path that maintains signal integrity
Solution Approach 2:
The patent changes key transmission parameters by using cables with controlled impedance conductors, optimized conductor geometries, and proper shielding configurations. These parameter changes in the transmission medium (from PCB traces to cables) reduce signal attenuation and maintain impedance matching, thereby improving signal integrity for high-speed data transmission
3Adaptability or versatility
If connectors are used to join printed circuit boards, then component replaceability improves and system adaptability increases, but connection density decreases and space utilization is reduced
Solution Approach 1:
The patent employs nested connector designs where smaller connector elements are integrated within larger housing structures. The connector assemblies feature nested contact structures, shielded conductors within insulative jackets, and compact mating interfaces that maximize connection density while minimizing the space required for each connector assembly on the printed circuit boards
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a low-loss path for high-speed signals with improved signal integrity and increased contact density, allowing for longer signal transmission distances and higher component packing in compact electronic devices, while maintaining reliability and reducing the need for mechanical fasteners.
Implementation Method 1
a first contact tip including a superelastic conductive material configured to mate with a first signal contact of a circuit board
Implementation Method 2
a pressure mount interface with a camming structure, which includes a housing with angled surfaces to generate mating force without mechanical components
Implementation Method 3
a first conductive coupler mechanically coupling the first contact tip to the first cable conductor
Data Source
AI summary
Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.