Midboard I/O Connector Alignment for Shorter Stubs at High Frequency
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Solution Overview
Problem
Existing interconnection systems, particularly I/O connectors, face challenges in maintaining high signal integrity and density when connecting high-speed components on printed circuit boards, as signal traces often fail to provide the required signal density and integrity for frequencies above 25 GHz, and conventional connectors design accommodates variability in contact positions leading to increased stub lengths and resonances.
Innovation Solution
The development of an I/O connector with a stack of terminal subassemblies featuring conductive elements with 90-degree bends for PCB attachment and others for cable termination, reducing variability through precise alignment with a stamped metal cage and alignment member, allowing for shorter pads and reduced stub lengths, thereby improving signal integrity at high frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional connector designs are used to accommodate variability in contact positions, then ease of manufacture is improved, but signal integrity deteriorates due to increased stub lengths and resonances at high frequencies
Solution Approach 1:
The patent replaces the conventional mechanical accommodation of contact position variability with a precision alignment system using a stamped metal cage and alignment members. This mechanical substitution eliminates the need for variable contact positions, thereby reducing stub lengths and resonances while maintaining ease of manufacture through the stamped metal construction.
2Device complexity
If signal traces on printed circuit boards are used for interconnection, then device complexity is reduced, but signal integrity deteriorates above 25 GHz due to insufficient signal density
Solution Approach 1:
The patent segments the interconnection system into distinct functional components: a precision-aligned connector assembly with stamped metal cage, terminal subassemblies, and cable termination points. This segmentation allows each component to be optimized for its specific function, achieving high signal integrity at 200 GHz while maintaining overall system simplicity through modular construction.
3Reliability
If I/O connectors are configured for cable connection to midboard, then signal integrity is improved through reduced stub lengths, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the manufacturing approach by using stamped metal construction for the cage and alignment members, which inherently provides precise dimensional control. This parameter change in the manufacturing process enables tight tolerances and high manufacturing precision without significantly increasing overall manufacturing complexity, thereby achieving both improved signal integrity and practical manufacturability.
Data Source
AI summary
An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for signals passing through the connector. The assembly may include a receptacle connector, a cage and cables, terminated to conductive elements of the terminal subassemblies, extending through the cage to the midboard. The terminal subassemblies may have first type conductive elements configured for mounting to the printed circuit board and second type conductive elements configured for terminating cables. Features may be included for precise positioning of the receptacle connector formed with the terminal subassemblies relative to the cage such that connector to connector variation in the positioning of the contact portions of the conductive elements in the terminal subassembly is provided. A mating plug may be designed with low wipe, which improves high frequency performance of the mated connector system.