Movable Middle Edge Ring Spring Compensation

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Solution Overview

Problem

In plasma etching processes, the edge rings in substrate processing apparatuses face challenges in maintaining thermal and electrical contact stability, particularly for the middle edge ring, which affects the uniformity of the etching process and productivity due to abrasion and potential tilting of the etching profile.

Innovation Solution

The substrate processing apparatus incorporates a three-piece edge ring system with an inner, middle, and outer edge ring, where the middle edge ring is vertically movable and secured through contacting members between the inner and outer edge rings, ensuring stable thermal and electrical contact and compensating for abrasion by adjusting the height of the middle edge ring to match the wafer and edge ring sheath levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the middle edge ring is made movable to compensate for abrasion, then the etching profile uniformity is improved, but the thermal and electrical contact stability deteriorates

Engineering Contradiction:
Improveetching profile uniformityVSAvoidthermal and electrical contact stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces a spring mechanism as an intermediary element between the movable middle edge ring and the fixed inner/outer edge rings. This spring acts as a mediator that maintains constant thermal and electrical contact pressure on the middle edge ring even during its vertical movement to compensate for abrasion, thus resolving the contradiction between movability and contact stability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent makes the middle edge ring vertically movable through a spring-loaded mechanism, allowing it to dynamically adjust its position to compensate for abrasion while maintaining continuous contact. This dynamic design enables the system to adapt to wear over time while preserving thermal and electrical contact through the spring's constant pressure

Inventive Principle:
Principle #15Dynamics

2Device complexity

If the edge ring is made as a single piece, then the structural simplicity is improved, but the ability to compensate for abrasion deteriorates

Engineering Contradiction:
Improveedge ring structureVSAvoidabrasion compensation capability
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent divides the edge ring into three separate components: an inner fixed edge ring, a middle movable edge ring, and an outer fixed edge ring. This segmentation allows the middle ring to be independently moved to compensate for abrasion while the inner and outer rings remain fixed, providing abrasion compensation capability without excessive complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By making only the middle edge ring movable while keeping the inner and outer rings fixed, the patent achieves a balanced design that provides necessary abrasion compensation capability without making the entire edge ring structure complex. The selective movability optimizes the balance between structural simplicity and functional capability

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains uniformity of the etching rate, reduces productivity variations, and prevents tilting of the etching profile by ensuring stable thermal and electrical contact, thereby enhancing process control and reducing the risk of abnormal discharges.

Implementation Method 1

a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS11257691B2Substrate processing apparatus
Publication Date: 2022.02.22 TOKYO ELECTRON LTD
  • US11257691B2 patent drawing
  • US11257691B2 patent drawing
  • US11257691B2 patent drawing

AI summary

There is provision of a substrate processing apparatus including an inner edge ring provided in a vicinity of a substrate to be placed on a stage in a processing chamber; a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism; an outer edge ring arranged outside the middle edge ring; a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring.