Middle Frame Adhesive Layout for Thinner Waterproof Housing
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Solution Overview
Problem
The bottleneck of existing electronic device designs, particularly in foldable devices, is the space occupied by the back adhesive between the middle frame and the battery cover, limiting the reduction of the device's overall thickness due to the adhesive covering the middle frame structures, which cannot be further minimized.
Innovation Solution
A housing assembly design with a recessed engagement portion on the middle frame that avoids the bottleneck, allowing the adhesive layer to be accommodated within the frame's thickness, ensuring structural strength and reducing the gap between the rear cover and the middle frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the back adhesive covers the middle frame structures to ensure waterproofing, then the waterproof effect is improved, but the device thickness increases due to the adhesive occupying space between the middle frame and battery cover
Solution Approach 1:
The patent changes the arrangement dimension of the adhesive layer by creating a recessed engagement portion on the middle frame. Instead of the adhesive occupying the thickness direction space between the middle frame and battery cover, it is redirected to occupy the lateral space within the recessed engagement portion. This dimensional redirection allows the adhesive to maintain waterproof sealing while reducing the overall device thickness.
2Length of stationary object
If the middle frame structures are minimized to reduce device thickness, then the device thickness is reduced, but the structural strength is compromised
Solution Approach 1:
The patent applies local quality by creating a recessed engagement portion at the specific location where the adhesive layer needs to be positioned. This localized structural modification allows the middle frame to maintain its overall minimal thickness while providing a specific region that accommodates the adhesive layer, thereby preserving structural strength at the critical bonding location without compromising the overall device thickness reduction goal.
3Length of stationary object
If the adhesive layer is reduced in thickness to minimize device thickness, then the device thickness is reduced, but the waterproof sealing capability is weakened
Solution Approach 1:
The patent compensates for the reduced adhesive thickness by changing the sealing dimension from the thickness direction to the lateral direction. The recessed engagement portion creates a lateral cavity that accommodates the thinner adhesive layer, allowing it to maintain adequate sealing volume and capability while reducing the thickness direction space occupied, thus achieving both thinness and waterproof performance.
Data Source
AI summary
This application provides an electronic device. The electronic device comprises a middle frame and an adhesive layer. The middle frame comprises a middle plate portion and a side frame portion. The side frame portion is provided with an insertion hole, an interface device is mounted in the insertion hole. A side hole wall that is of the insertion hole of the side frame portion and that faces the rear cover is provided with a first portion and a second portion, the first portion extends inward from an outer wall surface of the side frame portion, and the second portion is arranged on a side of the first portion facing away from the outer wall surface of the side frame portion. The adhesive layer is not arranged between the rear cover and the first portion, and the adhesive layer is arranged between the rear cover and the second portion.