Electronic Middle Frame with Electroplated Metal Layer for Heat Dissipation
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Solution Overview
Problem
Current middle frame materials in electronic products, such as mobile phones, fail to effectively dissipate heat due to low thermal conductivity, leading to excessively high temperatures in high-power consumption areas.
Innovation Solution
A middle frame member with a high coefficient of heat conductivity is achieved by electroplating metals like copper, silver, or gold on specific areas of the substrate body, enhancing heat conduction and reducing temperatures through horizontal and vertical heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional materials like die casting magnesium alloy, stainless steel, or aluminum alloy are used for the middle frame member, then the structural integrity and manufacturing feasibility are maintained, but the heat dissipation performance is insufficient due to low thermal conductivity (10-160 W/m.k)
Solution Approach 1:
The patent applies composite materials by combining a base middle frame member (made of traditional materials like aluminum alloy or stainless steel) with a heat-conducting layer (made of materials with high thermal conductivity such as copper, aluminum, or heat-conducting polymers). This composite structure allows the frame to maintain structural integrity while achieving superior heat dissipation performance through the high-conductivity layer that rapidly conducts heat away from heat-generating components.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the middle frame member by introducing a heat-conducting layer with significantly higher thermal conductivity than traditional frame materials. This parameter change transforms the thermal performance of the overall structure, enabling effective heat dissipation while the base material retains its mechanical properties and manufacturability.
2Adaptability or versatility
If high-power consumption components are placed in the middle frame member, then functional integration is improved, but excessive heat generation causes temperature rise that cannot be effectively dissipated
Solution Approach 1:
The heat-conducting layer acts as an intermediary between heat-generating components and the surrounding environment. It provides a dedicated thermal pathway that mediates heat transfer, allowing high-power components to be integrated into the middle frame while the heat-conducting layer efficiently conducts heat away from these components to prevent excessive temperature rise.
Solution Approach 2:
The patent segments the thermal management function by separating the heat dissipation pathway from the structural function. The heat-conducting layer is positioned specifically in contact with or near heat-generating components, creating a dedicated thermal management zone within the middle frame that allows high-power components to be integrated without compromising thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation performance effectively reduces temperatures in high-power areas, preventing overheating and enhancing the thermal management of electronic devices.
Implementation Method 1
a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, and the first metal layer is used to conduct, to the middle frame substrate body, heat generated by at least one of the components
Implementation Method 2
first metal with a high coefficient of heat conductivity is electroplated in a first area of a middle frame substrate body
Data Source
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AI summary
Embodiments of the present invention provide a middle frame member and a method for manufacturing a middle frame member. The middle frame member is a support part inside an electronic product for supporting components in the electronic product, and the middle frame member includes: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer. According to the embodiments of the present invention, heat dissipation performance of the middle frame member can be improved.