Middle Frame Vapor Chamber Layout for Thin Mobile Cooling
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Solution Overview
Problem
Existing mobile terminals face challenges in efficiently dissipating heat generated by high-performance components, which affects their service life and user experience due to inadequate heat dissipation methods.
Innovation Solution
A middle frame assembly incorporating a heat pipe connected to a vapor chamber for comprehensive heat conduction, utilizing two-dimensional extended conduction of the vapor chamber and one-dimensional linear conduction of the heat pipe to rapidly dissipate heat, with the heat pipe optionally connected through a heat conducting medium like a graphite material, and strategically positioned to avoid the battery to maintain a thin design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat plate or single heat pipe is used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The patent combines multiple heat pipes and vapor chambers into an integrated heat dissipation system. The first heat pipe connects the processor to the first vapor chamber, while the second heat pipe connects to the second vapor chamber, creating a merged thermal management architecture that improves heat dissipation efficiency without significantly increasing structural complexity
Solution Approach 2:
The heat dissipation system is segmented into multiple independent thermal pathways: a first heat pipe pathway leading to a first vapor chamber, and a second heat pipe pathway leading to a second vapor chamber. This segmentation allows heat to be distributed through multiple parallel channels, enhancing overall heat dissipation capacity
2Productivity
If heat dissipation components are added to improve heat dissipation efficiency, then heat dissipation performance is improved, but the device thickness increases
Solution Approach 1:
The heat pipes are positioned within or alongside the battery assembly space, and the vapor chambers are integrated into the device housing structure. This nesting approach allows heat dissipation components to occupy otherwise wasted space, improving heat dissipation efficiency without increasing the overall device thickness
Solution Approach 2:
The vapor chambers are designed as planar structures that expand in the horizontal plane rather than vertically. The first and second vapor chambers are positioned at different locations within the device footprint, distributing thermal management functions across two dimensions to avoid increasing device thickness
3Duration of action of stationary object
If heat is concentrated in one location, then the heat dissipation path is short, but the service life of the heat source is affected
Solution Approach 1:
The heat dissipation system segments the thermal load by directing heat from the processor through separate heat pipes to multiple vapor chambers. This segmentation distributes the thermal energy across multiple pathways, preventing heat concentration and reducing thermal stress on any single component, thereby extending service life
Solution Approach 2:
Different regions of the device are assigned different thermal management functions: the first vapor chamber handles heat from the processor, while the second vapor chamber manages heat from other components. This local specialization optimizes heat dissipation in each region and prevents harmful heat accumulation, protecting component service life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, prolongs the service life of the mobile terminal, and improves user experience by effectively transferring heat across a larger area of the middle frame, maintaining a thin and lightweight design.
Implementation Method 1
one-dimensional linear heat conduction of the heat pipe
Implementation Method 2
two-dimensional extended heat conduction of the first vapor chamber
Implementation Method 3
Heat conductivity of the heat conducting adhesive is twice over heat conductivity of an ordinary adhesive layer
Data Source
Figure 1a~1b
Figure 2
Figure 3
AI summary
This application provides a mobile terminal and a middle frame assembly of the mobile terminal. The middle frame assembly is configured to bear an electronic component in the mobile terminal. The electronic component includes a heat source, and the middle frame assembly includes a middle frame, one or more heat pipes, and a first vapor chamber. The middle frame includes a heat dissipation region corresponding to the heat source. The first vapor chamber is accommodated in the heat dissipation region. The heat pipes are connected to the first vapor chamber, and are configured to dissipate heat from the first vapor chamber. This application improves heat dissipation performance of the mobile terminal.