Mid-plane Assembly Thermal Management via Connector Nesting
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Solution Overview
Problem
High availability IT devices face challenges in effective cooling due to the complexity and redundancy of components, which can lead to thermal management issues affecting their reliability and functionality.
Innovation Solution
A mid-plane assembly with a circuit board featuring pinless electrical connectors and cooling passages, where the board connectors are positioned behind the drive connectors to optimize space for improved airflow and thermal circulation, and are electrically coupled using a reflow solder process, enabling efficient coupling to disk drives and a drive controller system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the circuit board surface area is reduced to improve cooling efficiency, then airflow and thermal management are improved, but the space available for positioning connectors and components is reduced
Solution Approach 1:
The patent positions board connectors on the second surface of the circuit board and places them at least partially behind drive connectors on the first surface, utilizing the third dimension (depth/layering) to resolve the spatial conflict. This allows both connector types to coexist on a reduced surface area circuit board while maintaining proper spacing for cooling airflow.
Solution Approach 2:
The board connectors are positioned behind the drive connectors in a nested arrangement along the depth axis of the circuit board. This nesting approach allows the connectors to share the same footprint area without interfering with each other, enabling surface area reduction while preserving connector functionality.
2Temperature
If board connectors are positioned behind drive connectors to optimize space, then cooling airflow is improved, but connector positioning complexity increases
Solution Approach 1:
By moving the positioning problem into the depth dimension (positioning connectors behind each other rather than side-by-side), the patent simplifies the airflow path while the connector arrangement becomes more systematic rather than truly complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by reducing the surface area of the circuit board, allowing for increased airflow and improved thermal management, thus enhancing the reliability and availability of high-availability storage systems.
Implementation Method 1
The one or more pinless electrical connectors of the at least one drive connector may be electrically coupled to the circuit board using a reflow solder process
Implementation Method 2
The circuit board may include a plurality of cooling passages configured to allow for the circulation of cooling air
Data Source
AI summary
A mid-plane assembly for use in an IT device includes a circuit board having a first surface and a second surface. At least one drive connector is positioned on the first surface of the circuit board. At least one board connector is positioned on the second surface of the circuit board and at least partially behind the at least one drive connector positioned on the first surface.