Midplane Board Mesh Topology for Sled Interconnect
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Solution Overview
Problem
Cabled computer network architectures face limitations due to signal degradation over distance, which can be mitigated by adding active components like repeaters, increasing complexity and cost.
Innovation Solution
A mesh computer network architecture using a passive midplane board to connect compute sleds, eliminating the need for cables and reducing signal degradation through shorter interconnect links and flexible sled placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If repeaters or active components are included to mitigate signal degradation, then signal transmission quality is improved, but device complexity and cost increase
Solution Approach 1:
The patent removes cables and active components (repeaters) from the network architecture by implementing a cableless interconnect system where compute sleds directly engage with a midplane board through integrated connectors, eliminating the need for separate cabling infrastructure and active signal boosting components
Solution Approach 2:
The midplane board serves multiple functions simultaneously: it provides structural support for compute sleds, establishes electrical interconnections, and enables signal transmission all through a single integrated platform, replacing the need for separate cables, connectors, and active components
2Adaptability or versatility
If cables are used to connect boards with multiple processors, then flexibility in connection topology is improved, but signal degradation over distance increases
Solution Approach 1:
The patent transitions from traditional three-dimensional cabled connections to a two-dimensional planar integration approach where compute sleds connect directly to the midplane board surface, reducing the vertical and lateral distances signals must travel through cables
Solution Approach 2:
The patent merges the cable infrastructure with the board structure itself by integrating connectors directly into the midplane board and compute sleds, eliminating the need for separate cabling and creating a unified interconnect platform that maintains topology flexibility while reducing signal path length
Data Source
AI summary
A system can include a midplane board and multiple sleds. Each sled can include a processor and an interconnect part. The interconnect part can be positioned at a lateral edge of the sled. Both sides of the midplane board can include interconnect portions that engage the interconnect parts from the sleds. The interconnect portions of the midplane board can be connected to enable inter-processor communication among processors on the sleds. For example, the midplane board may connect processors from first and second sleds received on one side of the midplane board with processors from third and fourth sleds received on an opposite side of the midplane board. The sleds may connect to power at rear, for example, being translated in a longitudinal direction to engage power and translated toward the midplane board and non-parallel to the longitudinal direction to engage the interconnect parts and portions.