Mid-Plate Conductive Paths for EMI and Heat-Constrained PCB Layouts
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Solution Overview
Problem
Existing electronic devices face challenges in managing heat and electromagnetic interference (EMI) due to signal lines, which can lead to damage and operational disruptions, while also occupying valuable internal space, making it difficult to mount other components.
Innovation Solution
A support structure with conductive paths that replace or integrate signal lines on a printed circuit board (PCB), maintaining internal space and reducing EMI without increasing volume, using insulated conductive paths and nonconductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the volume of signal lines or the distance between signal lines is increased to reduce EMI and heat, then EMI and heat management improve, but the internal mounting space of the electronic device is reduced
Solution Approach 1:
The patent transitions signal line routing from a planar two-dimensional layout on the PCB to a three-dimensional configuration using support structures that extend vertically. Conductive paths are formed on multiple surfaces and edges of support structures, enabling signals to route through the third dimension (height) of the device, thereby reducing the need for increased lateral spacing between signal lines while maintaining EMI and heat management.
Solution Approach 2:
The patent divides the signal routing function across multiple discrete support structures distributed throughout the device housing. Each support structure carries specific conductive paths, segmenting the overall signal routing task. This segmentation allows for optimized local spacing and routing configurations that reduce EMI and heat while efficiently utilizing the available internal mounting space.
2Reliability
If the signal line volume is increased to prevent heat damage, then signal line durability improves, but the internal space of the electronic device is reduced making it difficult to mount other elements
Solution Approach 1:
The patent utilizes the vertical dimension by forming conductive paths on the outer surfaces and edges of support structures that extend through the device housing. This three-dimensional routing approach increases the effective volume and heat dissipation capacity of signal lines without consuming additional lateral internal mounting space, as the routing occurs along the structural boundaries rather than within the internal component volume.
3Object-affected harmful factors
If the distance between signal lines is increased to reduce EMI, then EMI reduction improves, but the PCB size must be expanded reducing internal space
Solution Approach 1:
The patent eliminates the need for increased lateral spacing between signal lines by routing them through three-dimensional space using support structures. Conductive paths are formed on vertical surfaces and edges, allowing signal lines to be positioned closer together in the planar view while maintaining adequate electromagnetic separation through vertical and diagonal spacing in 3D space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances internal mounting space and reduces EMI, improving durability and operational reliability of electronic devices by optimizing signal line design and heat management.
Implementation Method 1
a conductive path extending from a first printed circuit board to a second printed circuit board
Implementation Method 2
The conductive path is surrounded by an insulating material, such as a nonconductive adhesive, within the housing
Data Source
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AI summary
An electronic device is provided. The electronic device includes a housing comprising a first plate, a second plate apart from the first plate while facing the first plate, and a side member which surrounds a space between the first plate and the second plate, a touchscreen display exposed through the first plate, a printed circuit board (PCB) disposed between the touchscreen display and the second plate, a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, and at least one integrated circuit (IC) mounted on the PCB and relating to power, wherein the mid-plate can include at least one conductive path formed on a surface facing the PCB and electrically connected to the at least one IC, and the at least one conductive path can be formed with the same metallic material as the mid-plate.