Millimeter-Wave Attenuation Film With Metal Plate Conductive Layer
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Solution Overview
Problem
Current electromagnetic wave absorption sheets are not compatible with millimeter-wave bands and are too thick for integration into device housings, making it difficult to suppress electromagnetic noise effectively.
Innovation Solution
A thin electromagnetic wave attenuation film with a dielectric substrate, a thin-film conductive layer of discretely arranged metal plates, and a planar inductor or lamination layer, which attenuates millimeter waves by converting incident waves into heat and re-emitting them with low directivity, reducing reflected waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional electromagnetic wave absorption sheets are used, then absorption performance in lower frequency ranges (20 GHz to several tens of GHz) is achieved, but compatibility with millimeter-wave bands (30 GHz or higher) is poor
Solution Approach 1:
The patent changes the physical and chemical parameters of the absorption material by using ultrafine particles (1-100 nm) with specific epsilon iron oxide crystal structures and controlling their packing density and orientation. These parameter changes enable the material to effectively absorb millimeter-wave frequencies (30 GHz or higher) while maintaining absorption performance across broader frequency ranges.
Solution Approach 2:
The patent employs composite material structures combining ultrafine epsilon iron oxide particles with specific binders and matrix materials. This composite approach creates a material system that maintains magnetic properties at millimeter-wave frequencies while achieving the desired absorption characteristics across multiple frequency bands.
2Reliability
If conventional electromagnetic wave absorption sheets are used, then absorption performance is maintained, but the thickness is too large for integration into device housings
Solution Approach 1:
The patent utilizes porous or loosely packed structures of ultrafine particles that provide high surface area and multiple reflection interfaces for electromagnetic waves. This porous arrangement enables effective absorption in thinner configurations by increasing the interaction path length of electromagnetic waves without proportionally increasing the overall sheet thickness.
Solution Approach 2:
By changing the particle size to ultrafine dimensions (1-100 nm) and controlling the packing density, the patent achieves effective absorption with reduced thickness. The ultrafine particles provide sufficient absorption performance while allowing the sheet to be thin enough for integration into device housings.
3Reliability
If radio wave absorbers with densely packed particles are used, then absorption performance in 25-100 GHz range is achieved, but the structure is complex and difficult to manufacture
Solution Approach 1:
The patent simplifies manufacturing by controlling particle size distribution and packing characteristics during the formulation stage rather than requiring complex post-processing. By selecting ultrafine particles with specific size ranges (1-100 nm) and using appropriate binders, the desired absorption performance is achieved through straightforward mixing and lamination processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film achieves effective attenuation of electromagnetic waves in millimeter-wave bands with a thickness of 1/4 or less than conventional sheets, providing good weather and heat resistance while maintaining a thin profile.
Implementation Method 1
converting incident waves into heat
Implementation Method 2
re-emitting them with low directivity
Data Source
AI summary
A thin electromagnetic wave attenuation film capable of attenuating electromagnetic waves having frequencies in millimeter-wave bands, comprising an electromagnetic wave attenuation film including a dielectric substrate having a front surface and a rear surface, a thin-film conductive layer disposed on the front surface, and a planar inductor or a lamination layer disposed on the rear surface, wherein the thin-film conductive layer includes a plurality of metal plates, and values of natural logarithms obtained by normalizing a thickness T of the metal plates by a skin depth d thereof are in predetermined numerical ranges within a predetermined frequency range. The electromagnetic wave attenuation film is used in the predetermined frequency range. A top coat layer may be provided on the thin-film conductive layer.