Millimeter-Wave Substrate Lamination for Low Loss and Flatness
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Solution Overview
Problem
Existing substrates for millimeter wave communication suffer from high signal loss due to large attenuation characteristics, and they face challenges in bonding with metal thin films and maintaining flatness due to high thermal expansion coefficients, especially when using Teflon dielectrics.
Innovation Solution
A method for producing a substrate for millimeter wave communication involves mixing ceramic powder with Teflon powder, dispersing the mixture, adding a solution and binder to form a paste, applying the paste to a metal thin film, drying, and thermally bonding a second metal thin film to achieve low loss characteristics, high bonding strength, and low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If Teflon dielectric is used to reduce signal loss, then dissipation factor is improved, but bonding strength with metal thin film deteriorates
Solution Approach 1:
The patent uses a composite dielectric material consisting of Teflon powder (60-80 wt%), ceramic powder (10-30 wt%), and binder (2-10 wt%). This composite structure combines the low dissipation factor of Teflon with the bonding capabilities of ceramic and binder materials, resolving the contradiction between signal loss reduction and bonding strength.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the dielectric by controlling particle size distribution (0.1-10 μm), density (1.8-2.2 g/cm³), and compositional ratios. These parameter changes enable the dielectric to achieve both low signal loss and adequate bonding strength through optimized material properties.
2Loss of energy
If Teflon dielectric is used to reduce signal loss, then dissipation factor is improved, but flatness deteriorates due to high thermal expansion
Solution Approach 1:
The composite dielectric combines Teflon powder with ceramic powder and binder materials that have complementary thermal expansion characteristics. This composite structure balances the high thermal expansion of Teflon with the lower expansion of ceramic components, maintaining flatness while preserving the low signal loss properties of Teflon.
Solution Approach 2:
The patent specifically addresses thermal expansion by selecting ceramic materials with expansion coefficients that complement Teflon. The composite formulation (60-80% Teflon, 10-30% ceramic, 2-10% binder) creates a dielectric with balanced thermal properties, reducing warpage and maintaining flatness during thermal processing while keeping signal loss low.
3Strength
If ceramic powder is mixed with Teflon powder to improve bonding, then manufacturing complexity increases, but dissipation factor worsens
Solution Approach 1:
The patent optimizes the concentration and particle size of ceramic powder (10-30 wt%, 0.1-10 μm) to achieve adequate bonding strength while minimizing impact on dissipation factor. The binder content is controlled at 2-10 wt% to ensure proper adhesion without excessive dielectric loss. These parameter optimizations balance bonding requirements with signal loss constraints.
Solution Approach 2:
The patent applies different material properties to different functional requirements: Teflon powder (60-80 wt%) provides low dissipation factor for signal transmission, while ceramic powder (10-30 wt%) and binder (2-10 wt%) provide bonding strength at the metal-dielectric interface. This local quality differentiation resolves the contradiction between bonding strength and dissipation factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting substrate exhibits low loss characteristics, high bonding strength with metal thin films, and a low coefficient of thermal expansion, effectively addressing the challenges of signal attenuation, bonding, and thermal stability in millimeter wave communication.
Implementation Method 1
the rotating body is rotated clockwise and the container is rotated counterclockwise to disperse
Implementation Method 2
it is dried at a temperature of about 100 to 270 degrees to evaporate the solvent
Implementation Method 3
thermally bonding a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film
Implementation Method 4
performed at a temperature equal to or higher than the melting temperature of Teflon
Data Source
AI summary
A method for producing a substrate for millimeter wave comprises the steps of: (a) mixing ceramic powder and Teflon powder; (b) dispersing the mixed ceramic powder and Teflon powder in a dispersion equipment; (c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the Teflon powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture; (d) applying the paste to a first metal thin film; (e) drying the first metal thin film to which the paste is applied; and (f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.