Active Mills Cross Sonar Arrays for High-Resolution DOA Interpolation
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Solution Overview
Problem
Conventional mills cross arrangements in sonar systems are limited by angular resolution, requiring long line arrays that are bulky and expensive, making them unsuitable for compact and cost-effective applications.
Innovation Solution
An active mills cross arrangement with high resolution interpolation of echo returns in two orthogonal planes, utilizing a transmitter and two line arrays to apply direction of arrival algorithms, reducing the required length of the arrays and improving resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If long line arrays with many elements are used to achieve very high resolution, then angular resolution is improved, but device complexity and cost increase
Solution Approach 1:
The patent applies dimensionality change by transitioning from a single-plane array to a three-dimensional cross arrangement with multiple line arrays oriented in different directions. This spatial reconfiguration enables high-resolution angular measurement in multiple dimensions simultaneously, achieving very high resolution without requiring excessively long individual arrays. The cross arrangement of line arrays in three-dimensional space provides comprehensive angular coverage through geometric interpolation rather than relying on a single long array.
Solution Approach 2:
The patent introduces direction-of-arrival algorithms as an intermediary processing mechanism that analyzes signal phase differences across multiple line arrays. This algorithmic intermediary enables the system to extract high-resolution angular information from the spatial distribution of signals received by the cross arrangement, achieving superior resolution without proportionally increasing array length. The algorithm processes the geometric relationships between signals across different array elements to compute precise arrival directions.
2Measurement precision
If long line arrays with many elements are used to achieve very high resolution, then angular resolution is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from a single-plane array to a three-dimensional cross arrangement with multiple line arrays oriented in different directions. This spatial reconfiguration enables high-resolution angular measurement in multiple dimensions simultaneously, achieving very high resolution without requiring excessively long individual arrays. The cross arrangement of line arrays in three-dimensional space provides comprehensive angular coverage through geometric interpolation rather than relying on a single long array.
Solution Approach 2:
The patent segments the measurement function across multiple independent line arrays arranged in a cross configuration. Instead of using one long array, the system divides the measurement task among several shorter arrays positioned at right angles to each other. Each array contributes to the overall resolution through its specific spatial orientation, and the combination of these segmented arrays achieves the desired resolution at lower individual array lengths and reduced manufacturing cost.
3Device complexity
If conventional mills cross arrangement is used, then system simplicity is maintained, but resolution is limited by beam width
Solution Approach 1:
The patent applies dimensionality change by transitioning from a single-plane array to a three-dimensional cross arrangement with multiple line arrays oriented in different directions. This spatial reconfiguration enables high-resolution angular measurement in multiple dimensions simultaneously, achieving very high resolution without requiring excessively long individual arrays. The cross arrangement of line arrays in three-dimensional space provides comprehensive angular coverage through geometric interpolation rather than relying on a single long array.
Solution Approach 2:
The patent replaces the mechanical limitation of beam width with a computational approach using direction-of-arrival algorithms. Instead of relying on the physical beam width of individual arrays to determine resolution, the system uses signal processing to calculate precise arrival directions based on phase differences across the cross arrangement. This substitution of mechanical resolution limits with algorithmic processing enables higher resolution while maintaining relative system simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables compact, cost-effective sonar systems with enhanced resolution and imagery quality, suitable for various mobile structures, by integrating multichannel sonar transducers and sensors to provide accurate bathymetric data and underwater imagery.
Implementation Method 1
a transmitter configured to emit one or more signals
Implementation Method 2
receive echo returns of the emitted signals from one or more objects or targets
Implementation Method 3
a first line array including a first plurality of elements defining a first plane, and a second line array including a second plurality of elements defining a second plane orthogonal to the first plane. At least one of the first line array and the second line array may be configured to receive echo returns
Implementation Method 4
interpolating, by the logic device in a plurality of planes, a direction of arrival algorithm to the received echo returns
Data Source
AI summary
Techniques are disclosed for systems and methods to provide high resolution interpolation of arrival direction of echo return signals using an active mills cross arrangement, such as in sonar or other ranging sensor systems. A system may include an active mills cross arrangement with high resolution interpolation of echo returns in two planes. The active mills cross arrangement may include a transmitter configured to emit one or more signals, a first line array including a first plurality of elements defining a first plane, and a second line array including a second plurality of elements defining a second plane orthogonal to the first plane. At least one of the first line array and the second line array may be configured to receive echo returns of the emitted signals from one or more objects or targets.