MIM Capacitor Barrier Structure for Low Leakage High-k Dielectrics

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Solution Overview

Problem

Next-generation Metal-Insulator-Metal (MIM) capacitors face challenges in reducing leakage current, especially when scaling down dimensions for high capacitance densities, and conventional materials with high dielectric constants suffer from high leakage currents, necessitating improved solutions for low leakage and high dielectric constant capacitors.

Innovation Solution

The use of a semiconductor material like nickel oxide as an electron barrier, combined with high-k dielectric and barriers, inhibits Poole-Frenkel emission by creating forbidden states around the conduction band edge, reducing leakage currents while maintaining high dielectric constants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional high-k dielectric materials are used to achieve high dielectric constants, then capacitance density is improved, but leakage current increases

Engineering Contradiction:
Improvecapacitance densityVSAvoidleakage current
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A semiconducting oxide layer is introduced as an intermediary between the metal electrode and the high-k dielectric material. This intermediate layer acts as a barrier that suppresses charge injection and Poole-Frenkel emission, thereby reducing leakage current while allowing the high-k dielectric to maintain its capacitance density benefits.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The capacitor structure employs a composite material system consisting of a metal electrode, semiconducting oxide barrier layer, and high-k dielectric material. This composite structure combines the high capacitance properties of the high-k dielectric with the low-leakage properties of the semiconducting oxide barrier, achieving both high capacitance density and low leakage current.

Inventive Principle:
Principle #40Composite materials

2Reliability

If dimensions are scaled down to increase capacitance density, then capacitance per area is improved, but leakage current becomes more significant

Engineering Contradiction:
Improvecapacitance densityVSAvoidleakage current
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The invention changes the material parameters at the electrode-dielectric interface by introducing a semiconducting oxide layer with specific electronic properties. This parameter change in the interfacial material composition creates a barrier that suppresses leakage mechanisms, allowing scaled-down dimensions to achieve high capacitance density without proportionally increasing leakage current.

Inventive Principle:
Principle #35Parameter changes

3Object-generated harmful factors

If high work function electrodes are used to reduce leakage current, then leakage is reduced, but device complexity increases

Engineering Contradiction:
Improveleakage currentVSAvoidelectrode material selection
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

Rather than relying on complex high work function electrode materials, the invention uses a semiconducting oxide intermediary layer that simplifies the electrode structure. This intermediate layer provides the leakage reduction function without requiring specialized high work function materials, thereby reducing device complexity while maintaining low leakage performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces leakage currents by up to an order of magnitude without increasing equivalent oxide thickness, making it suitable for high-bias applications and enhancing capacitance densities in MIM capacitors.

Implementation Method 1

the proximal barrier being constructed and arranged to inhibit Poole-Frenkel emission from the high-k dielectric when a first electric field is applied between the proximal contact and a distal contact

Methodology Applied
Scientific EffectPoole-Frenkel emission: Pool-Frenkel Effect

Data Source

PatentUS20240339493A1Low leakage capacitors, and related structures, methods, and systems
Publication Date: 2024.10.10 ASM IP HLDG BV
  • US20240339493A1 patent drawing
  • US20240339493A1 patent drawing
  • US20240339493A1 patent drawing

AI summary

Structures and related methods and systems for forming structures. The structures comprise a proximal contact, a distal contact, a high-k dielectric, and at least one of a proximal barrier and a distal barrier. In some embodiments, at least one of the proximal barrier and the distal barrier is constructed and arranged to inhibit Poole-Frenkel emission from the high-k dielectric when a first electric field is applied between the proximal contact and a distal contact in a first electric field direction.