MIM Capacitor Corrugated Profile via Directed Self-Assembly
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Solution Overview
Problem
Integrated circuits (ICs) in deep-submicron process nodes face challenges in providing sufficient power delivery due to limitations in capacitance per unit area, particularly for devices like integrated voltage regulators, where increasing the number of capacitor plates increases manufacturing costs and IC bulk.
Innovation Solution
The implementation of a metal-insulator-metal (MIM) capacitor with a corrugated profile, achieved through directed self-assembly (DSA) techniques or sacrificial layers that segregate into patterns upon heat treatment, allowing for increased capacitance per unit area without the need for additional lithographic operations or increased IC bulk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional planar plate-based MIM capacitors are used, then manufacturing process is simple, but capacitance per unit area is insufficient
Solution Approach 1:
The patent transitions from planar 2D capacitor plates to a 3D corrugated structure with ridges and grooves. This dimensional change increases the effective surface area of the capacitor plates, thereby increasing capacitance per unit area without requiring additional lithographic operations or increasing IC bulk.
Solution Approach 2:
The patent introduces curved/corrugated surfaces instead of flat planar surfaces. The corrugated profile with ridges and grooves increases the surface area of the capacitor plates, enabling higher capacitance per unit area while maintaining compatibility with existing fabrication flows.
2Power
If the number of capacitor plates is increased to provide sufficient power delivery, then power delivery capability is improved, but manufacturing cost and IC bulk increase
Solution Approach 1:
By transitioning to a 3D corrugated structure, the patent increases the effective capacitance per unit area without adding more capacitor plates or layers. This maintains the same manufacturing process complexity while achieving higher power delivery capability through increased capacitance density.
Solution Approach 2:
The patent changes the geometric parameters of the capacitor structure by introducing corrugations with specific ridge and groove dimensions. This parameter change increases the effective surface area and capacitance per unit area, enabling sufficient power delivery without increasing the number of capacitor plates.
3Power
If the number of capacitor plates is increased to provide sufficient power delivery, then power delivery capability is improved, but IC bulk increases
Solution Approach 1:
The patent uses vertical corrugations within the existing planar footprint to increase capacitance. This approach increases power delivery capability without expanding the IC area or bulk, as the additional capacitance is achieved through 3D surface structuring rather than adding more plates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a fourfold or greater increase in capacitance per unit area compared to traditional planar plate-based MIM capacitors, reducing manufacturing costs and enhancing power delivery capabilities while maintaining compatibility with existing fabrication flows.
Implementation Method 1
a sacrificial masking layer of self-organizing material over the first dielectric layer, patterning the masking layer, wherein the patterning includes a non-subtractive process that causes the masking layer to self-organize into distinct structures
Implementation Method 2
a sacrificial layer of material that coalesces into isolated islands when sufficiently heated
Implementation Method 3
depositing a metal-insulator-metal (MIM) capacitor over the patterned first dielectric layer
Data Source
AI summary
Techniques and structure are disclosed for providing a MIM capacitor having a generally corrugated profile. The corrugated topography is provisioned using sacrificial, self-organizing materials that effectively create a pattern in response to treatment (heat or other suitable stimulus), which is transferred to a dielectric material in which the MIM capacitor is formed. The self-organizing material may be, for example, a layer of directed self-assembly material that segregates into two alternating phases in response to heat or other stimulus, wherein one of the phases then can be selectively etched with respect to the other phase to provide the desired pattern. In another example case, the self-organizing material is a layer of material that coalesces into isolated islands when heated. As will be appreciated in light of this disclosure, the disclosed techniques can be used, for example, to increase capacitance per unit area, which can be scaled by etching deeper capacitor trenches/holes.