MIM Capacitor Adjustable via Electronic Fuse Rupture

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Solution Overview

Problem

Capacitance variation in metal-insulator-metal (MIM) capacitors during semiconductor device fabrication leads to inconsistent device performance and increased yield loss, as dimensions of metal layers and dielectric layers can vary, affecting capacitance values.

Innovation Solution

A method is introduced to measure the capacitance value of MIM capacitors and selectively rupture connections between secondary metal plates and the primary metal plate to adjust the capacitance to a target value, reducing variation by removing excess capacitance associated with secondary metal plates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If MIM capacitors are fabricated using conventional BEOL processes, then manufacturing simplicity is maintained, but capacitance variation between devices increases

Engineering Contradiction:
Improvecapacitance uniformityVSAvoidcapacitor structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The second metal layer is divided into a primary metal plate and multiple secondary metal plates. Each secondary metal plate can be independently connected or disconnected from the primary metal plate through selective rupture of connections, allowing precise adjustment of capacitance values to compensate for fabrication variations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The capacitor structure transitions from a fixed configuration to a dynamically adjustable one. By selectively rupturing connections between secondary metal plates and the primary metal plate after capacitance measurement, the capacitance value can be fine-tuned to achieve target values and reduce device-to-device variation.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If all secondary metal plates are connected to the primary metal plate, then maximum capacitance is achieved, but capacitance exceeds target value and increases variation

Engineering Contradiction:
Improvecapacitance accuracyVSAvoidyield
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The process incorporates capacitance measurement feedback. After measuring the actual capacitance value of each MIM capacitor, the system determines whether the value exceeds the target and selectively ruptures specific connections to reduce capacitance to the desired range, ensuring high yield and precision.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The capacitance parameter is adjusted by changing the physical connectivity state of the secondary metal plates. By rupturing specific connections, the effective capacitance area is reduced, allowing precise control of the capacitance value to match target specifications.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If connections are selectively ruptured to adjust capacitance, then capacitance variation is reduced, but manufacturing process complexity increases

Engineering Contradiction:
Improvecapacitance controlVSAvoidfabrication process
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The secondary metal plates and connections are pre-configured during fabrication with the intention of selective rupture. This preliminary structure allows post-fabrication adjustment without requiring complex real-time manufacturing processes, simplifying the overall ease of manufacture while maintaining precision.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively fine-tunes the capacitance of MIM capacitors to a target value, reducing capacitance variation between devices and improving yield by ensuring consistent performance and reducing defective devices.

Implementation Method 1

the MIM capacitor comprises a first metal layer, a first dielectric layer disposed above the first metal layer, and a second metal layer disposed above the first dielectric layer

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS11631614B2MIM capacitor with adjustable capacitance via electronic fuses
Publication Date: 2023.04.18 QUALCOMM INC
  • US11631614B2 patent drawing
  • US11631614B2 patent drawing
  • US11631614B2 patent drawing

AI summary

Certain aspects of the present disclosure are generally directed to techniques and apparatus for adjusting capacitance in one or more metal-insulator-metal (MIM) capacitors in an effort to reduce capacitance variation between semiconductor devices and improve yield during fabrication. One example method for fabricating a semiconductor device generally includes measuring a capacitance value of a MIM capacitor of the semiconductor device, determining the measured capacitance value of the MIM capacitor is above a target capacitance value for the MIM capacitor, and selectively rupturing a set of connections in the MIM capacitor based on the measured capacitance value. Selectively rupturing the set of connections in the MIM capacitor may reduce the capacitance value of the MIM capacitor to a value approximately that of the target capacitance value.