MIM Capacitor Dielectric Lamination With Interlayer Particle Cleaning
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Solution Overview
Problem
In the manufacturing of MIM capacitors, fine foreign substances can attach to the dielectric surface during formation, leading to defect portions with reduced thickness, which increases electric field strength, decreases dielectric breakdown voltage, and reduces reliability by varying the capacitor's performance.
Innovation Solution
A method involving multiple laminations of dielectric layers, where the upper surface of each layer is cleaned using jet or dual fluid cleaning to remove particles, ensuring the desired electrode distance and reducing reliability variations by compensating for thickness reductions with subsequent dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the dielectric is formed by laminating it a plurality of times on the lower electrode, then the desired electrode distance can be achieved, but fine foreign substances attach to the dielectric surface during formation, creating defect portions that reduce reliability
Solution Approach 1:
The dielectric formation process is segmented into multiple separate lamination steps rather than forming the entire dielectric thickness in one step. This allows for intermediate cleaning operations between lamination steps, removing foreign substances that accumulate during each formation process. The segmentation of the manufacturing process enables quality control interventions that prevent reliability degradation.
Solution Approach 2:
Cleaning operations are performed as preliminary actions between dielectric lamination steps. By cleaning the dielectric surface after initial lamination and before subsequent lamination steps, foreign substances are removed in advance, preventing them from causing defect portions in the final dielectric structure. This preliminary cleaning action ensures that subsequent lamination occurs on a clean surface.
2Reliability
If cleaning is performed to remove organic substances and oxides from the lower electrode surface, then leakage current is prevented, but the cleaning process adds time and complexity to the manufacturing process
Solution Approach 1:
The cleaning operations are merged with the existing dielectric lamination process flow. Rather than adding separate, standalone cleaning steps, the cleaning is integrated into the sequence of dielectric formation operations. This merging approach maintains the necessary cleaning function while reducing overall process complexity by utilizing existing process steps for multiple purposes.
Solution Approach 2:
The dielectric lamination process itself serves the dual function of both forming the dielectric structure and providing opportunities for cleaning. The repeated lamination steps naturally create intermediate stages where cleaning can be performed, making the lamination process self-sufficient for both structure formation and quality maintenance without requiring entirely separate cleaning systems.
3Manufacturing precision
If the dielectric thickness is reduced due to foreign substance attachment, then the electric field strength increases, but this decreases the dielectric breakdown voltage and reduces capacitor reliability
Solution Approach 1:
Cleaning operations are performed as preliminary actions between dielectric lamination steps to remove foreign substances before they can cause thickness reductions. By cleaning the surface in advance of subsequent lamination, the dielectric can be deposited uniformly without being interrupted by foreign particles, preventing the formation of thin spots that would increase electric field strength and risk breakdown.
Solution Approach 2:
The multi-step lamination process with intermediate cleaning acts as a cushioning mechanism against foreign substance contamination. By preparing clean surfaces beforehand through intermediate cleaning steps, the process compensates for and prevents the harmful effects of foreign substance attachment, ensuring uniform dielectric thickness and preventing electric field concentration that would lead to breakdown.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the variation in capacitor reliability by ensuring consistent dielectric thickness and preventing dielectric breakdown, thereby enhancing the manufacturing process's precision and performance.
Implementation Method 1
an upper surface of the first dielectric layer is cleaned by at least one of jet cleaning and dual fluid cleaning
Implementation Method 2
an upper surface of the first dielectric layer is cleaned by at least one of jet cleaning and dual fluid cleaning
Data Source
AI summary
A capacitor having a MIM structure includes a dielectric formed by laminating a plurality of times on an upper surface of a lower electrode, and an upper electrode on an upper surface of the dielectric. Forming of the dielectric includes forming the first dielectric layer on the upper surface of the lower electrode, cleaning an upper surface of the first dielectric layer by at least one of jet cleaning and dual fluid cleaning, and forming the second dielectric layer on an upper surface of the cleaned first dielectric layer.