MIM Capacitor and Resistor Via Etch Stop Integration
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Solution Overview
Problem
The integration of high precision MIM capacitors and metal resistors in integrated circuits is costly and time-consuming due to the need for additional patterning and etching steps, especially when forming via etch stop landing pads for thin film resistors, which complicates the manufacturing process.
Innovation Solution
Forming via etch stop landing pads on the heads of high precision resistors using the same material as the MIM capacitor bottom plate, thereby reducing the need for separate thin film deposition, patterning, and etching steps, and integrating them into the existing interconnect layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate thin film deposition, patterning, and etching steps are used to form via etch stop landing pads for precision resistors, then good electrical contact and high precision are achieved, but manufacturing complexity and cycle time increase significantly
Solution Approach 1:
The patent combines the formation of via etch stop landing pads with the existing capacitor bottom plate formation process. The capacitor bottom plate material is deposited and patterned to simultaneously create both the capacitor structure and the via etch stop landing pads, eliminating separate deposition and patterning steps for the landing pads.
Solution Approach 2:
The capacitor bottom plate material serves dual functions: forming the capacitor electrode and creating via etch stop landing pads for precision resistors. This multi-functional approach allows a single material layer to fulfill multiple structural roles in the integrated circuit.
2Manufacturing precision
If additional patterning and etching steps are added to integrate precision resistors with MIM capacitors, then high precision components are achieved, but manufacturing cost and cycle time increase
Solution Approach 1:
The via etch stop landing pads are formed preliminarily during the capacitor fabrication process before the precision resistor is fully integrated. By preparing the landing pad structure in advance using existing process steps, subsequent resistor formation requires fewer additional steps.
Solution Approach 2:
Multiple functions are merged into existing process steps: the capacitor bottom plate deposition and patterning simultaneously creates the capacitor structure and the via etch stop landing pads, reducing the total number of manufacturing steps required.
3Manufacturing precision
If thin film resistor material is made extremely thin to achieve high resistance values, then high precision resistance is achieved, but the material becomes too resistive to function as a MIM capacitor plate
Solution Approach 1:
The patent segments the functional requirements: the precision resistor uses extremely thin film material for high resistance precision, while the capacitor bottom plate uses a separate, more conductive material layer. This segmentation allows each component to have optimal material properties for its specific function without compromise.
Solution Approach 2:
Different regions of the structure use different material qualities: the precision resistor region uses very thin film material for high resistance precision, while the capacitor plate region uses thicker, more conductive material. Each local area has material properties optimized for its specific electrical function.
Data Source
AI summary
An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision resistor where via etch stop landing pads over the resistor heads are formed using the same layer that is used to form the capacitor bottom plate.